两种镀液体系下助熔剂对耐蚀性的影响  

Effect of flux on corrosion resistance in two tinning systems

作　　者：杜国锋 王爱红[1] 李吉超 才士文 DU Guofeng;WANG Aihong;LI Jichao;CAI Shiwen(Shougang Jingtang United Iron and Steel Co.,Ltd.,Tangshan 063200,Hebei,China)

机构地区：[1]首钢京唐钢铁联合有限责任公司,河北唐山063200

出　　处：《金属功能材料》2025年第1期92-97,共6页Metallic Functional Materials

摘　　要：分析了国内两种不同镀液体系即TS镀液体系与KK镀液体系下,不同助熔剂浓度对镀锡板耐蚀性影响。结果表明,TS镀液体系的最佳助熔剂浓度为12 mL/L,KK镀液体系的最佳助熔剂浓度为8 mL/L。结合扫描电镜与X射线衍射的检测结果可知,TS镀液体系相对KK镀液体系所制备出的镀锡板质量更好,从微观形貌与晶粒取向分析来看,TS镀液体系制备的镀锡板枝晶生长整体情况更好。The effects of different flux concentrations on corrosion resistance of two different tinning systems in China,namely TS bath system and KK bath system,were analyzed.The results show that the optimum flux concentration of TS bath system is 12 ml/L,and that of KK bath system is 8 mL/L.Combined with the detection results of scanning electron microscopy and X-ray diffraction,it can be seen that the quality of tin plate prepared by TS bath system is better than that prepared by KK bath system.From the perspective of microscopic morphology and grain orientation analysis,the dendrite growth of tin plate prepared by TS bath system is better.

关 键 词：电镀锡 助熔剂 耐蚀性 晶粒 

分 类 号：TQ153.13[化学工程—电化学工业]