散热片类结构的EMC风险评估与预处理方法  

EMC Risk Assessment and Pre-treatment Methods for Heat Sink-like Structures

作　　者：张少勇 Zhang Shaoyong

机构地区：[1]TCL电子控股有限公司

出　　处：《安全与电磁兼容》2025年第2期60-64,共5页Safety & EMC

基　　金：深圳市科技重大专项(KJZD20240903100303005)。

摘　　要：在电路与系统中,经常遇到带有散热片的高频器件导致的EMC问题。以腔模理论为基础,把这类EMC问题归结为一类腔体模型,通过仿真分析其在关注的频段内可能存在的谐振点和谐振模式,准确预测可能的EMC风险,并采用改进结构或做接地等措施,避免EMC问题的发生。实验表明,该方法下的仿真和实验结论非常接近,对散热片类结构下高频器件的EMC风险评估和预处理准确有效。In circuits and systems,high-frequency devices with heat sinks often lead to electromagnetic compatibility(EMC)issues.Based on cavity mode theory,this study models such EMC problems as a class of cavity structures.Through simulation analysis,potential resonance points and modes within the frequency range of interest are identified to accurately predict EMC risks.Structural improvements or grounding measures are then implemented to mitigate these issues.Experimental results demonstrate that the simulation and experimental findings under this method are in close agreement,validating the accuracy and effectiveness of the proposed approach for EMC risk assessment and preemptive optimization in high-frequency devices with heat sink configurations.

关 键 词：散热片 腔模理论 电磁兼容 电磁干扰 谐振模式 

分 类 号：TP3[自动化与计算机技术—计算机科学与技术]