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作 者:Zhaoyang Li Yong Shen Yang Zhou Bing Zhou Chuntai Liu Yuezhan Feng
机构地区:[1]State Key Laboratory of Structural Analysis,Optimization and CAE Software for Industrial Equipment,National Engineering Research Center for Advanced Polymer Processing Technology,Zhengzhou University,Zhengzhou 450002,China [2]Shangqiu Normal University,Shangqiu 476000,China
出 处:《Journal of Materials Science & Technology》2024年第30期9-16,共8页材料科学技术(英文版)
基 金:the National Natural Science Foundation of China(Nos.52273085 and 52303113);the Natural Science Foundation of China of Henan Province(No.222300420541);the Key Scientific Research Projects of Colleges and Universities in Henan Province,China(No.24A430045).
摘 要:Conductive polymer composites(CPCs)have attracted significant interest in the field of flexible electro-magnetic protection,but the challenge of balancing high electromagnetic interference shielding effec-tiveness(EMI SE)and low reflection losses still exists.Herein,thermoplastic polyurethane/silver nanorod(TPU/AgNR)composite foams have been successfully prepared using both the salt template and vacuum-assisted thermal compression methods.By varying the AgNRs content and employing a layer-by-layer bonding approach,a gradient structure with optimized impedance matching is achieved.The“absorb-reflect-reabsorb”EM attenuation mechanismofthe asymmetricgradientEMI shieldingin theinternal structure is exploited,resulting in TPU/AgNR foam(TAF)with high EMI SE and significantly reduced EM reflection.Notably,the three-layer foams exhibit an average shielding efficacy of 35.5 dB and a reflected power coefficient(R)of 0.085 in the X-band,thereby substantially mitigating secondary EM wave reflec-tions.Furthermore,these foams demonstrate exemplary compressive resilience,with the sample main-taining excellent EMI shielding stability even after undergoing 100 compression cycles at 50%strain.Consequently,a straightforward approach is employed to fabricate materials with high EMI SE and low reflectivity,offering the potential for use in EM shielding applications of next-generation flexible elec-tronic devices.
关 键 词:Thermoplastic polyurethane foam Asymmetric gradient structure EMI shielding EM wave absorption Mechanical properties
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