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作 者:孙向洋 延浩 燕群[1] Sun Xiangyang;Yan Hao;Yan Qun(National Key Laboratory of Strength and Structural Integrity,Aircraft Strength Research Institute of China,Xi'an,Shaanxi,710065,China)
机构地区:[1]中国飞机强度研究所强度与结构完整性全国重点实验室,陕西西安710065
出 处:《飞行器强度研究》2024年第4期37-43,共7页Aircraft Strength Research
摘 要:民用飞机低频减振降噪是目前函待解决的实际问题,含包覆层型局域共振声子晶体具有出色的低频降噪性能,掌握其带隙特性就成为解决问题的关键步骤。本文在单包覆层声子晶体基本模型的基础上,对比分析了相同工况下双包覆层声子晶体的能带结构,对带隙的上下边界进行了模态分析,阐述了双包覆层声子晶体产生低频带隙的原因,进一步研究了结构参数对于含包覆层型声子晶体带隙的影响情况,发现对于单包覆层声子晶体,随着包覆层厚度的增加,带隙整体向低频移动,带隙数量增多,带宽变化不大;对于双包覆层声子晶体,随着外包覆层厚度与内包覆层厚度比值的增大,双包覆层声子晶体的带隙整体向低频移动,第一带隙的起始频率逐渐降低,带宽逐渐减小,第二带隙逐渐打开,并且随着厚度比的增大而增大。本文的结果可对局域共振声子晶体的结构设计及仿真分析提供一定的理论指导,将进一步推动声子晶体结构的工程化应用。Low-frequency vibration and noise reduction of civil aircraft is a practical problem that needs to be solved urgent-ly,and the local resonant phononic crystal with coating has excellent low-frequency noise reduction performance.Mastering the bandgap characteristics is a critical step in solving the problem.Based on the basic model of single cladding phononic crystal,the energy band structure of double cladding phononic crystal under the same working condition is analyzed.The modal analysis of the upper and lower boundary of the band gap is carried out.The reason of the low frequency band gap in the double cladding layer is discussed.The influence of structure parameters on the band gap of the coated phononic crystal is further studied.It is found that with the increase of the thickness of the cladding layer,the overall band gap moves to low frequency,the number of band gaps increases,and the bandwidth changes little.For double clad phononic crystals,with the increase of the ratio of the outer cladding thickness to the inner cladding thickness,the band gap moves to the low fre-quency,the initial frequency of the first band gap gradually decreases,the bandwidth gradually decreases,and the second band gap gradually opens,and increases with the increase of the thickness ratio.The results of this paper will provide some theoretical guidanceforpractical engineering application.
关 键 词:含包覆层型声子晶体 能带结构 模态分析 数值模拟
分 类 号:TG1[金属学及工艺—金属学]
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