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作 者:安东澜 李永亮 邸安乐 马丽 贺华 黄涛[1] An Donglan;Li Yongliang;Di Anle;Ma Li;He Hua;Huang Tao(AVIC Xi’an Flight Automatic Control Research Institute,Xi’an 710065,Shaanxi,China)
机构地区:[1]航空工业西安飞行自动控制研究所,陕西西安710065
出 处:《中国胶粘剂》2025年第3期46-50,共5页China Adhesives
摘 要:环氧树脂与固化剂混合后普遍开始固化反应,因此存在适用期短、贮存困难等问题。有必要建立一种快速可靠的低温贮存性能评估方法,以便对所有环氧固化体系进行快速验证,使之能在结果可靠的前提下降低试验成本。本研究以两种不同的环氧固化体系为研究对象,在不同温度下对黏度进行表征,按Arrhenius方程拟合,推导出凝胶时间和贮存温度之间的关系,最后根据贮存要求设计了合理贮存温度。研究结果表明:(1)黏度和凝胶时间测试结果表明:在−80℃的贮存温度下,间苯二甲胺固化体系和咪唑固化体系到达贮存期时性能和新配胶相比差异不大,均优于原−20℃贮存胶到达贮存期时的性能。(2)剪切强度测试结果表明:两种固化体系下−80℃贮存胶在到达贮存期时剪切强度满足要求,高于−20℃贮存胶,且和新配胶性能基本一致。(3)在间苯二甲胺固化体系下,−20℃贮存胶的剪切强度略低于指标要求,存在使用风险;在咪唑固化体系下,−20℃贮存胶的剪切强度满足指标要求。Epoxy resin and curing agent begin the curing reaction generally after mixing,thus resulting in problems such as short storage life and storage difficulties.It is necessary to establish a rapid and reliable lowtemperature storage performance evaluation method for all epoxy curing systems,enabling rapid verification while reducing testing costs under the premise of reliable results.In this study,two different epoxy curing systems were taken as the research object,and the viscosity was characterized at different temperatures.According to Arrhenius equation fitting,the relationship between gel time and storage temperature was derived.Finally,the reasonable storage temperature was designed based on the storage requirements.The research results showed that,(1)The results of viscosity and gel time tests showed that at the storage temperature of−80℃,the properties of mphenyldimethylamine curing system and imidazole curing system after reaching the storage life were similar to those of the new formulation,and were better than those of the original adhesive at the storage temperature of−20℃after reaching the storage life.(2)The shear strength test results showed that the shear strength of the adhesive at the storage temperature of−80℃under both curing systems met the requirements after reaching the storage life,also higher than that of the adhesive at the storage temperature of-20℃,and was basically consistent with the performance of the newly formulated adhesive(.3)Under the curing system of m-phenyldimethylamine,the shear strength of adhesive stored at−20℃was slightly lower than the required index,which posed a risk of use.Under the curing system of imidazole,the shear strength of adhesive stored at−20℃met the specified requirements.
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