锡基钎料和银基钎料对石墨和无氧铜钎焊接头组织及性能的影响研究  

Study on the Influence of Tin-based and Silver-based Brazing Materials on the Microstructure and Properties of Graphite and Oxygen Free Copper Brazing Joints

作　　者：贺佳伊 玉昆[2] 潘朋 刘芳[1] 李志军[2] HE Jiayi;YU Kun;PAN Peng;LIU Fang;LI Zhijun(University of Shanghai for Science and Technology,School of Materials and Chemistry,Shanghai 200093,China;Shanghai Institute of Applied Physics,Chinese Academy of Sciences,Shanghai 201800,China)

机构地区：[1]上海理工大学材料与化学学院,上海200093 [2]中国科学院上海应用物理研究所,上海201800

出　　处：《电焊机》2025年第3期103-109,共7页Electric Welding Machine

基　　金：中国科学院上海应用物理研究所科技之星项目(E2551130);中国科学院青年创新促进会人才项目(E2292202)。

摘　　要：为克服石墨表面难以润湿的难题,采用AgCuTi活性钎料焊膏在石墨表面进行金属化,再采用典型的锡基钎料SnAgCu、银基钎料AgCuTi间接钎焊连接金属化的石墨和无氧铜。探究不同钎料在连接金属化石墨和铜上的工艺及剪切性能问题,主要包括界面结合、组织形态和结合强度的问题。试验结果表明,在真空850℃保温5 min的条件下成功实现了对石墨表面的金属化,金属化层主要为银-铜共晶组织,并在石墨表面形成了均匀的TiC层。钎焊结果表明:使用银基钎料的接头,钎料与金属化层结合较好,无明显的缺陷。剪切断裂发生在石墨的母材侧,最终形成的典型界面为铜/铜基固溶体+银基固溶体+TiCu/TiC/石墨。锡基钎料与金属化层间存在明显的缺陷,剪切断裂发生在钎缝,典型界面组织为铜/Cu_(3)Sn/Cu_(6)Sn_(5)/β-Sn/银-铜共晶/TiC/石墨。To address the challenge of wetting the graphite surface,AgCuTi active brazing filler metal is utilized for metallization,while typical tin-based solder SnAgCu and silver-based brazing filler metal AgCuTi are employed for indirect brazing to establish connections between metallized graphite and oxygen-free copper.Investigating the process and shear performance of various brazing materials for connecting metallized graphite and copper,primarily focusing on aspects related to interface bonding,microstructure,and bonding strength.Experimental results demonstrated successful metallization of the graphite surface under vacuum insulation conditions at 850℃for 5 minutes.The metallization layer primarily consisted of a silver-copper eutectic,with a uniform TiC layer formed on the surface of the graphite.The brazing results indicate that the joint utilizing silver-based brazing material exhibits strong bonding between the brazing material and the metallized layer,with no apparent defects.Shear fracture occurs on the graphite's base metal side,forming a typical interface comprising cop‐per/copper-based solid solution+silver-based solid solution+TiCu/TiC/graphite.Conversely,noticeable defects are observed between the tin-based brazing material and the metallized layer,resulting in shear fracture at the brazing seam.The typical interface structure consists of copper/Cu_(3)Sn/Cu_(6)Sn_(5)/β-Sn/silver-copper eutectic/TiC/graphite.

关 键 词：石墨 钎焊 无氧铜 微观结构 剪切性能 

分 类 号：TG454[金属学及工艺—焊接]