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作 者:王东亮 薛行雁 张陕南 WANG Dongliang;XUE Hangyan;ZHANG Shannan(State Key Laboratory of Advanced Brazing Filler Metals and Technology,Zhengzhou Research Institute of Mechanical Engineering Co.,Ltd.,Zhengzhou 450001,China)
机构地区:[1]中国机械总院集团郑州机械研究所有限公司,新型钎焊材料与技术国家重点实验室,河南郑州450001
出 处:《电焊机》2025年第3期117-121,共5页Electric Welding Machine
摘 要:针对Cu基钎料加工性能差、高温钎焊导致碳钢母材组织劣化等问题,采用Sn_(28)Ag_(18)Cu_(18)Ga_(18)Bi_(18)高熵合金作为金属粘结剂,与Cu_(62)Sn_(22)Ni_(6)Mn_(10)钎料复合制备新型无银钎料。通过粉末冶金工艺实现复合钎料的成形加工,其钎焊温度降低至770℃,显著低于传统Cu基钎料。微观分析表明,高熵合金的高熵效应有效抑制Fe元素扩散,将界面金属间化合物层厚度控制在0.8μm,并减少焊缝脆性相生成。力学性能测试显示复合钎焊接头抗拉强度达265 MPa,较单一Cu基钎料提升约32%。组织结构表征证实复合钎料由Ag_(0.72)Ga_(0.28)化合物、Sn基固溶体及Bi相构成,元素扩散行为得到有效调控。该复合钎料兼具优异加工性能和力学性能,为碳钢低温钎焊提供了创新解决方案。To address the issues of poor processability in Cu-based solders and base metal structural degradation caused by high-temperature brazing in carbon steel,this study developed a novel silver-free composite solder by incorporating Sn_(28)Ag_(18)Cu_(18)Ga_(18)Bi_(18) high-entropy alloy as a metallic binder with Cu_(62)Sn_(22)Ni_(6)Mn_(10) solder.The composite solder was fabricated through powder metallurgy,achieving a significantly reduced brazing temperature of 770℃compared to conventional Cu-based solders.Microstructural analysis revealed that the high-entropy effect effectively suppressed Fe element diffusion,restricting the interfacial intermetallic compound layer thickness to 0.8μm while minimizing brittle phase formation in the joint.Mechanical testing demonstrated a tensile strength of 265 MPa for the composite brazed joint,representing approximately 32%enhancement over the single Cu-based solder.Structural characterization confirmed the composite solder comprised Ag_(0.72)Ga_(0.28) compounds,Sn-based solid solutions,and Bi phases,with optimized elemental diffusion behavior.This composite solder system provides an innovative low-temperature brazing solution for carbon steel,combining superior processability with enhanced mechanical performance.
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