键合金丝交流熔断电流的建模与分析  

Modeling and analysis of AC fusing current of gold bonding wire

作　　者：曹小鸽 张艳肖[1] CAO Xiaoge;ZHANG Yanxiao(School of Electrical and Information Engineering,Xi’an Jiaotong University City College,Xi’an 710018,China)

机构地区：[1]西安交通大学城市学院电气信息学院,西安710018

出　　处：《贵金属》2025年第1期48-53,62,共7页Precious Metals

基　　金：陕西省“十四五”教育科学规划2022年度课题(SGH22Y1722)。

摘　　要：键合丝在通高频电流时,受趋肤效应的影响,其交流电阻值普遍大于直流电阻值,从而导致键合丝交流熔断电流值与直流熔断电流值不同。本文在考虑趋肤效应的基础上介绍键合丝交流电热耦合相关理论;用COMSOL Multiphysics有限元软件建立键合金丝交流电热耦合仿真模型;用该仿真模型对键合金丝的交流熔断电流进行仿真。结果表明,在其他条件相同的条件下,键合金丝的交流电阻值大于直流电阻值,并且交流电阻值随着频率的升高而增大;键合金丝的交流熔断电流比直流熔断电流小,并且交流熔断电流值随着频率的升高而减小。该仿真模型及结果可为键合金丝交流熔断电流的分析提供参考。When a high frequency current passes through a bonding wire,the AC resistance of the bonding wire is generally larger than its DC resistance due to the skin effect,which leads to the discrepancy of the AC and DC fusing current.In this paper,a theory of AC electrothermal coupling of bonding wire is introduced firstly,considering the skin effect.Secondly,the AC electrothermal coupling simulation model of the gold bonding wire is established by using COMSOL Multiphysics finite element software.Lastly,the AC fusing current of the gold bonding wire is simulated by this model.The results show that when other conditions are equal,the AC resistance of the gold bonding wire is larger than the DC resistance,and increases as the frequency increases;the AC fusing current of the gold bonding wire is smaller than the DC fusing current,and decreases as the frequency increases.The simulation model and results can provide reference for the analysis of the AC fusing current of the gold bonding wire.

关 键 词：键合金丝 交流 熔断电流 有限元 

分 类 号：TG146[一般工业技术—材料科学与工程] TG422.3[金属学及工艺—金属材料]