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作 者:胡安琪 查云飞 Hu Anqi;Zha Yunfei(Fujian University of Technology,Fuzhou 350000)
机构地区:[1]福建理工大学,福州350000
出 处:《汽车文摘》2025年第4期48-55,共8页Automotive Digest
摘 要:针对汽车印刷电路板(Printed Circuit Board,PCB)布线布局引起的信号串扰与反射现象,利用Candence仿真软件对高速信号线反射现象进行建模,分析信号反射原因,并利用反射的阻抗匹配方案进行端接设计,对比了串联端接、戴维南端接、RC端接、二极管端接4种不同类型的端接对传输线中信号质量的影响,并通过电源平面设计对电源完整性进行改良设计,显著提高了PCB的电磁兼容性能。研究表明,信号完整性、电源完整性以及电磁干扰三者相互影响、相互制约,结合仿真数据对三者进行可靠性设计,能够显著提高PCB的电磁兼容性能。To address signal crosstalk and reflection phenomena caused by the wiring layout of automotive Printed Circuit Boards(PCBs),a simulation software Cadence is utilized to model the reflection phenomena of high-speed signal lines.The causes of signal reflection are analyzed,and impedance matching schemes for reflection are employed in the termination design.The effects of 4 different types of terminations,namely series termination,Thevenin termination,RC termination,and diode termination,on the signal quality in transmission lines are compared.Additionally,enhancements are made to power integrity through optimized power plane design,which significantly enhances the Electromagnetic Compatibility(EMC)performance of the PCB.The study demonstrates that signal integrity,power integrity,and electromagnetic interference are interrelated and mutually constraining.Conducting reliability designs for these 3 aspects by combining stimulation data can significantly improve the EMC performance of PCBs.
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