热-光双固化丙烯酸树脂减黏胶的制备和性能研究  

Preparation and properties of a thermal‑photo dual‑curing acrylic resin tack‑reducing adhesive

作　　者：陈思源 何立凡[1] 韩亚男 吴风娇 CHEN SiYuan;HE LiFan;HAN YaNan;WU FengJiao(College of Materials Science and Engineering,Beijing University of Chemical Technology,Beijing 100029,China)

机构地区：[1]北京化工大学材料科学与工程学院,北京100029

出　　处：《北京化工大学学报(自然科学版)》2025年第2期34-40,共7页Journal of Beijing University of Chemical Technology(Natural Science Edition)

摘　　要：以丙烯酸异辛酯(2-EHA)、丙烯酸正丁酯(BA)、甲基丙烯酸甲酯(MMA)、丙烯酸(AA)为主单体,以丙烯酸羟乙酯(2-HEA)和甲基丙烯酸异氰基乙酯(MOI)作为功能和接枝单体,使用过氧化苯甲酰(BPO)/偶氮二异丁腈(AIBN)复合引发剂体系,在溶液聚合条件下,制备出芯片加工用热-光双固化减黏用丙烯酸树脂材料。该材料在异氰酸酯固化剂存在下可以经热固化成膜,提供晶圆加工固定所必需的黏接强度,体系中通过接枝引入的双键可以在一定功率/时间的UV紫外光辐照下再次固化,即UV减黏,以实现加工后树脂从芯片上的剥离。通过对合成树脂的结构和剥离性能的研究,发现BPO/AIBN配比对分子链支化程度存在着显著影响,进而可以实现对UV固化前后的剥离强度的调节。Using 2-ethylhexyl acrylate,butyl acrylate,methyl methacrylate,and acrylic acid as the main mono-mers,with hydroxyethyl acrylate and isocyanoethyl methacrylate as the functional and grafting monomers,respec-tively,and dibenzoyl peroxide(BPO)/azo diisobutyronitrile(AIBN)as the complex initiation system,a thermo-photo dual-curing acrylic resin material has been prepared under solution polymerization conditions for use as a tack-reducing adhesives used in wafer processing.The material can be thermally cured into a film in the presence of an isocyanate curing agent to provide the adhesive strength necessary for wafer fixation.Furthermore the double bond introduced by grafting can be cured a second time under UV irradiation,giving UV tack reduction,in order to realize the peeling of the resin from the chip after processing.The structures and peeling properties of the synthetic resin were systematically studied.The BPO/AIBN ratio has a significant effect on the degree of molecular chain branching,which allows for the tailoring of the peeling strength before and after UV curing.

关 键 词：丙烯酸树脂 接枝 固化 剥离 

分 类 号：TQ436.3[化学工程]