56 Gbps+高速PCB信号完整性研究  

Research on signal integrity of 56 Gbps+high speed PCB products

作　　者：周军林 曹小冰 杨润伍 李德银 黄力 白冬生 ZHOU Junlin;CAO Xiaobing;YANG Runwu;LI Deyin;HUANG Li;BAI Dongsheng(Zhuhai Chifang Electronics Co.,Ltd.,Zhuhai 510310,Guangdong,China)

机构地区：[1]珠海驰方电子有限公司,广东珠海510310

出　　处：《印制电路信息》2025年第3期12-16,共5页Printed Circuit Information

摘　　要：随着高速信息传输速率的不断提升,印制电路板(PCB)的信号完整性对通信系统性能有着至关重要的影响。结合实际产品的叠层,通过试验设计对56 Gbps+高速PCB产品信号完整性进行研究,验证在叠层中采用不同树脂含量(RC)与半固化片(PP)搭配对信号完整性的影响;收集不同试验条件下的切片数据,进一步对比不同PP与RC搭配方式的差异,并根据研究结果提出设计建议。With the continuous improvement of high-speed information transmission rate,the signal integrity of PCB has a crucial impact on the electrical performance of the information system.In this paper,the signal integrity of 56Gbps+high-speed PCB products is studied and verified by combining the layup of actual products and DOE experiments.The effects of combinations with different PP RC content on signal integrity were studied,and cross-section data under different experimental conditions were collected to further compare the differences of different PP RC combinations,and design suggestions were introduced based on the experiments results.

关 键 词：印制电路板 高频高速 信号完整性 半固化片树脂 

分 类 号：TN41[电子电信—微电子学与固体电子学]