5G通信基站用多模块集成PCB关键技术研究  

Research on key technology of multi-module integrated printed circuit board for 5G communication base station

作　　者：孟昭光 MENG Zhaoguang(Dongguan Wuzhu Electronic Technology Co.,Ltd.,Dongguan 523000,Guangdong,China;Guangdong Printed Circuit Board(Wuzhu)Engineering Technology Research Center,Dongguan 523000,Guangdong,China)

机构地区：[1]东莞市五株电子科技有限公司,广东东莞523000 [2]广东省印制电路板(五株)工程技术研究中心,广东东莞523000

出　　处：《印制电路信息》2025年第3期27-28,29-32,共6页Printed Circuit Information

摘　　要：多模块集成印制电路板是保障5G基站信号可靠传输不可或缺的载体元器件。只要涉及信号传输的场所均需设置基站且需使用印制电路板,因此,5G通信基站用多模块集成印制电路板的应用前景广阔。介绍5G通信基站用多模块集成印制电路板制作方法,总结并分析相关核心技术,包括高低频材料的混压、低轮廓铜面处理技术、恒温式真空二流体蚀刻、大盲孔制作技术与高精度背钻技术,以期为5G通信基站用多模块集成印制电路板的自主研发与产业化制作提供借鉴。This paper analyzes and introduces the key technologies of multi-module integrated printed circuit board for 5G communication base stations,including:Mixed pressure,low profile copper surface treatment technology,constant temperature vacuum two-fluid etching,large blind hole production technology and high precision back drilling technology of high and low frequency materials,through technical analysis and summary,intended to provide reference for the production of multi-module integrated printed circuit boards for 5G communication base stations.

关 键 词：高低频介质混压 低轮廓铜箔 二流体蚀刻 高精度背钻 

分 类 号：TN41[电子电信—微电子学与固体电子学]