波峰焊后油墨脱落的原因探讨  

Discussion on the causes of ink detachment after wave soldering

作　　者：刘德志 杨鹤 LIU Dezhi;YANG He(Victory Giant Technology(Hui Zhou)Co.,Ltd.,Huizhou 516211,Guangdong,China)

机构地区：[1]胜宏科技(惠州)股份有限公司,广东惠州516211

出　　处：《印制电路信息》2025年第3期52-55,共4页Printed Circuit Information

摘　　要：在印制电路板(PCB)的装配和互联过程中,有时在波峰焊后会出现油墨脱落现象,对产品的外观和品质造成影响。为解决油墨脱落问题,从PCB自身和波峰焊过程中寻找可疑因子,并对其展开分析验证。结果显示,在高温条件下,波峰焊治具材料即钛合金会对油墨进行攻击,进而导致油墨脱落。此结果可为类似问题的解决提供依据。When the printed circuit board is assembled,sometimes the ink will fall off after wave soldering,which affects the appearance and quality of the product.The article starts with the SM peel off issue,analyzes and verifies the suspicious factors from PCB itself and the wave soldering process,summarizes the mechanism of S/M peel off caused by the attack of the wave soldering Jig-itanium alloy Jig under high temperature conditions,which provides an analysis basis for similar issues.

关 键 词：波峰焊 油墨脱落 治具 

分 类 号：TN41[电子电信—微电子学与固体电子学]