热重分析在印制电路行业的应用  

Application research of thermogravimetric analysis in printed circuit industry

作　　者：罗旭晖 丘威平 杨单 LUO Xuhui;QIU Weiping;YANG Dan(Kinwong Electronic Technology(Longchuan)Co.,Ltd.,Heyuan 517373,Guangdong,China;Metal-based printed Circuit Board Engineering Technology Research and Development Center in Guangdong Province,Heyuan 517373,Guangdong,China;Heyuan Key Laboratory of High Density and High Heat Dissipation Circuit Board,Heyuan 517373,Guangdong,China)

机构地区：[1]景旺电子科技(龙川)有限公司,广东河源517300 [2]广东省金属基印制电路板工程技术研究开发中心,广东河源517373 [3]河源市高密度高散热电路板企业重点实验室,广东河源517373

出　　处：《印制电路信息》2025年第3期56-61,共6页Printed Circuit Information

摘　　要：在印制电路(PCB)的生产和研发中,对物料和产品的热稳定性有着极高要求,而热重分析(TGA)是研究材料热性能的有效方法,近年来被广泛应用于PCB领域。基于热重分析仪原理,研究其在物料热稳定性测试对比、复合材料热性能分析、有机物来料检验以及材料腐蚀/老化前后热性能对比中的应用,并通过热重分析基本原理、实验设计、结果处理和热重曲线分析,得出TGA具有研究PCB半固化片、覆铜板、有机原材料热分解温度和热稳定性,有机物料物性检测,材料固含量分析等的详细表征作用,可为PCB行业发展提供相应的“热”支撑。In the manufacture and R&D of the printed circuit board(PCB)industry,there are significant requirements for the thermal stability of materials and products.Thermogravimetric analysis(TGA)is an effective method for studying the thermal properties of materials and has been widely applied in the PCB field in recent years.Based on the principle of the thermogravimetric analyzer,this paper studies its application in the comparison of thermal stability of materials,thermal performance analysis of composite materials,incoming inspection of organic materials,and comparison of thermal performance after corrosion/aging test.Through the basic principle of thermogravimetric analysis,experimental design,result processing,and thermogravimetric curve analysis,it is concluded that TGA has a detailed characterization role in researching the thermal decomposition temperature and thermal stability of semi-cured sheets,copper clad laminates,and organic raw materials in the PCB industry,physical property detection of organic materials,and solid content analysis of materials,providing corresponding"thermal"support for the development of the PCB industry.

关 键 词：热重分析 印制电路板 热性能 热分解温度 

分 类 号：TN41[电子电信—微电子学与固体电子学]