半导体晶圆激光切割加工焦点位置自动检测方法  

Automatic Detection Method for Focus Position of Semiconductor Wafer Laser Cutting Processing

作　　者：宋婉贞[1] SONG Wanzhen(The 45th Research Institute of CETC,Beijing 100176,China)

机构地区：[1]中国电子科技集团公司第四十五研究所,北京100176

出　　处：《自动化应用》2025年第6期225-227,共3页Automation Application

摘　　要：由于传统的激光切割焦点位置检测方法多采用接触式或机械式方式,存在操作复杂、精度不高等问题,因此提出半导体晶圆激光切割加工焦点位置自动检测方法。首先设计柔性电容式传感器进行标定,将标定后的柔性电容式传感器安装在晶圆上方,然后通过电容量计算加工焦点和被加工对象间位置,实现加工焦点位置的高精度自动检测。实验结果表明,应用设计方法,其半导体晶圆激光切割加工焦点位置自动检测结果最大误差仅为0.09 mm,满足高精度的检测需求。Due to the traditional laser cutting focus position detection methods mostly relying on contact or mechanical approaches,there are problems of complex operation and low accuracy.Therefore,an automatic detection method for focus position of semiconductor wafer laser cutting processing is proposed.First,a flexible capacitive sensor is designed for calibration and installed above the semiconductor wafer.Then,the position between the machining focus and the object being processed is calculated through capacitance,achieving high-precision automatic detection of the machining focus position.The experimental results show that using this method,the maximum error in automatic detection of the focus position for semiconductor wafer laser cutting is only 0.09 mm,which meets the high-precision detection requirements.

关 键 词：半导体晶圆 激光切割 加工焦点 焦点位置 高精度自动检测 柔性电容式传感器 

分 类 号：TH721.4[机械工程—仪器科学与技术]