Sandwich-structured In-Ga alloy phase change thermal pad with low thermal resistance and leakage prevention  

作　　者：Ping-Jun Luo Xu Huang Hao-Ran Yang Sheng Chu 

机构地区：[1]School of Materials Science and Engineering,Sun Yat-Sen University,Guangzhou,510006,China

出　　处：《Rare Metals》2024年第12期6639-6648,共10页稀有金属(英文版)

基　　金：financially supported by the National Natural Science Foundation of China (Nos.11204097 and U1530120)。

摘　　要：With the rapid increase in chip integration and power density,there is a growing need to develop advanced thermal interface materials for effective thermal management.Liquid metals with high thermal conductivity,excellent gap-filling capability and non-toxicity have received much attention.However,low-melting-point metals,such as galinstan and indium-bismuth-tin(EInBiSn) eutectic alloys,are prone to leaking,which limits their applications.In this study,In-Ga alloy composite thermal pads with a sandwich structure and a graphite film as an intermediate layer were prepared.The In-Ga alloy composition was adjusted so that these pads underwent partial phase change in the operating temperature range of the laptop CPU(50-100℃).This results in low thermal resistance and leakage prevention.The thermal resistance of the InGa5,InGa15 and InGa25 alloy thermal pads decreases to 7.3,4.1 and 2.66 K·mm^(2)·W^(-1),respectively,at a temperature and pressure of 100℃ and 50 psi.In a test measuring the actual cooling effect of the fabricated material on a CPU,the InGa 15 alloy thermal pad maintained the average CPU temperature at 90.1 ℃,significantly better than the EInBiSn thermal pad with an average CPU temperature of 94.1℃,and comparable to Galinstan,which had an average CPU temperature of 89.3℃.Due to their good heat dissipation and leak-proof properties,InGa alloy composite thermal pads are expected to become a new generation of thermal interface materials.

关 键 词：In-Ga alloy Phase change Composite thermal pad Low thermal resistance Leakage prevention 

分 类 号：TG146.43[一般工业技术—材料科学与工程] TK124[金属学及工艺—金属材料]