Laser-induced thermo-compression bonding for Cu-Au heterogeneous nanojoining  

作　　者：Hui Wan Yu Shu Shuo Chen Hao Cao Shengjun Zhou Sheng Liu Chengqun Gui 

机构地区：[1]School of Power and Mechanical Engineering,Wuhan University,Wuhan 430072,People’s Republic of China [2]The Institute of Technological Sciences,Wuhan University,Wuhan 430072,People’s Republic of China [3]Hubei Key Laboratory of Electronic Manufacturing and Packaging Integration,Wuhan University,Wuhan 430072,People’s Republic of China [4]The Key Laboratory of Transients in Hydraulic Machinery of Ministry of Education,Wuhan University,Wuhan 430072,People’s Republic of China

出　　处：《International Journal of Extreme Manufacturing》2025年第1期409-418,共10页极端制造(英文)

基　　金：supported by the National Natural Science Foundation of China(Nos.52305612 and U20A6004);Open Fund of Hubei Key Laboratory of Electronic Manufacturing and Packaging Integration(Wuhan University)(NO.EMPI2023015).

摘　　要：Surface tension-induced shrinkage of heterogeneously bonded interfaces is a key factor in limiting the performance of nanostructures.Herein,we demonstrate a laser-induced thermo-compression bonding technology to suppress surface tension-induced shrinkage of Cu-Au bonded interface.A focused laser beam is used to apply localized heating and scattering force to the exposed Cu nanowire.The laser-induced scattering force and the heating can be adjusted by regulating the exposure intensity.When the ratio of scattering forces to the gravity of the exposed nanowire reaches 3.6×10^(3),the molten Cu nanowire is compressed into flattened shape rather than shrinking into nanosphere by the surface tension.As a result,the Cu-Au bonding interface is broadened fourfold by the scattering force,leading to a reduction in contact resistance of approximately 56%.This noncontact thermo-compression bonding technology provides significant possibilities for the interconnect packaging and integration of nanodevices.

关 键 词：thermo-compression bonding Cu-Au bonding contact interface laser scattering force 

分 类 号：TG1[金属学及工艺—金属学]