不同分子结构环氧树脂低温线膨胀系数的表征与分析  

Characterization and Analysis of Low Temperature Linear Expansion Coefficient of Epoxy Resins with Different Molecular Structures

作　　者：陈晓丹 石家宾 CHEN Xiao-dan;SHI Jia-bin(Department of Computer and Information Engineering,Heilongjiang University of Science&Technology,Harbin 150022,China;School of Astronautics,Harbin Institute of Technology,Harbin 150001,China)

机构地区：[1]黑龙江科技大学计算机与信息工程学院,黑龙江哈尔滨150022 [2]哈尔滨工业大学航天学院,黑龙江哈尔滨150001

出　　处：《节能技术》2025年第1期52-57,共6页Energy Conservation Technology

基　　金：哈尔滨市科技创新人才研究专项基金(2014RFQXJ028)。

摘　　要：环氧树脂的热膨胀系数具有强温度依赖性,对其在低温环境下的应用有着显著影响。对此,本文选取了三种具有不同分子结构的代表性环氧树脂,三官能团脂环族环氧树脂TDE-85、通用型双酚A型环氧树脂E-51以及双酚F型线型结构的环氧树脂AM8927。测试表征了三种不同分子结构的环氧树脂从室温到-196℃温度范围内的热膨胀系数,结果表明分子链段的构型、侧链、交联度、官能团等因素的综合作用是影响环氧树脂低温线膨胀系数的关键。在此基础上,通过添加低热膨胀系数的n-SiO_(2)粒子对环氧树脂进行共混改性,研究了无机纳米填料粒子对环氧树脂低温热膨胀性能的影响,结果表明n-SiO_(2)纳米粒子通过界面增强、相补效应和钉扎作用等,能够抑制EP分子链段运动,降低环氧树脂的低温线膨胀系数。The thermal expansion coefficient of epoxy resin has strong temperature dependence,which has a significant impact on their application in low temperature environments.In this paper,three representative epoxy resins with different molecular structures were selected,namely trifunctional aliphatic cyclic epoxy resin TDE-85,general-purpose bisphenol A-type epoxy resin E-51 and bisphenol F-type epoxy resin AM8927.The thermal expansion coefficients of three epoxy resins with different molecular structures from room temperature to-196℃were characterized,the variation of thermal expansion coefficients with temperature was studied,and the influence mechanism of molecular structure of epoxy resins on the linear expansion coefficient of low temperature was revealed.On the basis of the experimental results,the effect of inorganic nanofiller particles on the low-temperature thermal expansion performance of epoxy resin was studied by adding n-SiO_(2) particles with low thermal expansion coefficient to the blending modification of epoxy resin,and the results showed that n-SiO_(2) nanoparticles could inhibit the movement of EP molecular segments and reduce the low-temperature linear expansion coefficient of epoxy resin through interface enhancement,complementarity effect and pinning.

关 键 词：纳米二氧化硅粒子 分子结构 环氧树脂 超低温 线膨胀系数 

分 类 号：TB332[一般工业技术—材料科学与工程]