新型耐高温防霉剂的制备及应用  

Preparation and application of high-temperature-resistant fungicide

作　　者：王磊 任河 张玥 孙全吉 范召东 WANG Lei;REN He;ZHANG Yue;SUN Quanji;FAN Zhaodong(AECC Beijing Institute of Aeronautical Materials,Beijing 100095,China;Baimtec Material Co.,Ltd.,Beijing 100095,China)

机构地区：[1]中国航发北京航空材料研究院,北京100095 [2]北京航空材料研究院股份有限公司,北京100095

出　　处：《航空材料学报》2025年第2期82-90,共9页Journal of Aeronautical Materials

摘　　要：采用多巴胺预沉积结合化学镀银的方法,在四针状氧化锌晶须(T-ZnO_(w))表面实现纳米银负载,制备银锌复合防霉剂。研究多巴胺沉积时间以及银氨溶液浓度对T-ZnO_(w)表面镀银效果的影响,确定最佳的改性条件。银锌复合防霉剂与耐高温型有机硅密封剂并用后,可以将有机硅密封剂的防霉等级从2级提升至1级,并且不会影响密封剂本身的耐热性能及粘接性能。此外,密封剂老化后的防霉等级仍能达到1级,说明银锌复合防霉剂具备良好的热稳定性。Nano-Ag was deposited onto the surface of T-ZnOw through a process combining dopamine deposition with the chemical reduction of silver,yielding a novel silver-zinc fungicide.The study explored the impact of dopamine deposition duration and silver ammonia solution concentration on the deposition efficacy of nano-Ag,ultimately determining the optimal reaction conditions.The incorporation of this silver-zinc fungicide enhance the antifungal properties of the silicone sealant,without compromising its heat resistance or adhesion.Furthermore,the mold-proof rating of the aged sealant remain at level 1,demonstrating the excellent thermal stability of the T-ZnO_(w)/PDA/Ag fungicide.

关 键 词：四针状氧化锌晶须 防霉 纳米银 耐高温 有机硅密封剂 

分 类 号：V255.3[一般工业技术—材料科学与工程]