TYPE C点胶溢胶的控制方法设计与工艺研究  

Design and Process Research of Control Method for TYPE C Adhesive Spill

作　　者：宁海波 周贤臣 郄建华 NING Haibo;ZHOU Xianchen;QIE Jianhua(Guangdong Huazhan Electronics Co.,Ltd.,Dongguan,Guangdong 523000,China)

机构地区：[1]广东华旃电子有限公司,广东东莞523000

出　　处：《移动信息》2025年第3期388-390,共3页Mobile Information

摘　　要：Type-C接口是电子电器设备最为频繁使用接触的部件之一,日常使用会存在进水、浸液、灰尘、频繁插拔等现象,在不匹配的充电设备的情况下会带来电路老化、腐蚀等问题。因此,对产品点胶进行密封的技术应运而生,其可以有效解决浸液腐蚀等问题,从而在市面上广泛使用该技术。文中探讨了TYPE C点胶溢胶产生的原因,并提出了相应的控制方法和工艺改进措施,以期达到提高点胶质量,延长产品使用寿命的目的。The Type-C interface is one of the most frequently used components in electronic and electrical equipment.In daily use,there may be issues such as accidental water ingress,immersion,dust,and frequent plugging and unplugging.In the case of mismatched charging devices,it can cause problems such as circuit aging and corrosion.Therefore,the technology of sealing product glue has emerged,which can effectively solve problems such as immersion corrosion,and is widely used in the market.This paper explores the causes of adhesive overflow in TYPE C dispensing and proposes corresponding control methods and process improvement measures to improve dispensing quality and extend product lifespan.

关 键 词：type-c接口 溢胶现象 设计与工艺 

分 类 号：TP391[自动化与计算机技术—计算机应用技术]