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作 者:唐浩祥 刘涌 周明巧 孙宜勇 Tang Hoaxing;Liu Yong;Zhou Miya;Sun Yiyong
机构地区:[1]上海美维电子有限公司,上海201613 [2]安捷利美维电子(厦门)有限公司,福建厦门361026
出 处:《印制电路资讯》2025年第2期71-74,共4页Printed Circuit Board Information
摘 要:随着无人驾驶技术的兴起,毫米波雷达产品需求也在日益增加。作为毫米波雷达核心之一的天线与PCB的关系不可谓不密切。天线板对于天线精度的要求使其天线位置的铜厚通常不会设计得太厚,而其余区域无需设计较薄的铜厚,在对于铜厚不同的要求下,出现了对于阶梯铜线路板的需求。在此基础上,部分天线板在设计时在天线所在区域制作有激光孔与机械孔,进一步增加了阶梯铜制作的难度。本文对天线区域内存在通盲孔的阶梯铜线路板进行制作研究,确定了此种线路板的制作流程及相关制作能力。With the rise of autonomous driving technology,the demand for millimeter wave radar products is also increasing day by day.As one of the core components of millimeter wave radar,the relationship between the antenna and PCB is closely related.The requirement for antenna accuracy on antenna boards means that the copper thickness at the antenna position is usually not designed to be too thick,while other areas do not need to be designed with thinner copper thickness.Under different requirements for copper thickness,there is a demand for stepped copper circuit boards.On this basis,some antenna boards are designed with laser holes and mechanical holes in the area where the antenna is located,further increasing the difficulty of producing stepped copper.This paper conducts research on the production of stepped copper circuit boards with blind holes in the antenna area,and confirms the production process and related production capabilities of such circuit boards.
分 类 号:TN9[电子电信—信息与通信工程]
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