Study on Dry Electrical Discharge Assisted Grinding of SiCp/Al Composite  

作　　者：Yanjun Lu Yuming Huang Xiaobu Liu Rong Cheng Shunda Zhan 

机构地区：[1]Guangdong Provincial Key Laboratory of Micro/Nano Optomechatronics Engineering,College of Mechatronics and Control Engineering,Shenzhen University,Shenzhen 518060,China [2]School of Intelligent Manufacturing and Equipment,Shenzhen Institute of Information Technology,Shenzhen 518172,China

出　　处：《Chinese Journal of Mechanical Engineering》2025年第1期106-118,共13页中国机械工程学报(英文版)

基　　金：Supported by National Natural Science Foundation of China(Grant Nos.52475480,51805334);Guangdong Basic and Applied Basic Research Foundation(Grant Nos.2023A1515030249,2023A1515110059);Shenzhen Science and Technology Program(Grant No.GJHZ20220913144212023).

摘　　要：SiC-reinforced aluminum matrix(SiCp/Al)composite is widely utilized in the aerospace,automotive,and electronics industries due to the combination of ceramic hardness and metal toughness.However,the significant disparity in properties between SiC particles and the aluminum matrix results in severe tool wear and diminished surface quality during conventional machining.This study proposes an environmentally friendly and clean dry electrical discharge assisted grinding process as an efficient and low-damage machining method for SiCp/Al.An experimental platform was set up to study the impact of grinding and discharge process parameters on surface quality.The study compared the chip formation mechanism and surface quality between dry electrical discharge assisted grinding and conventional grinding,revealing relationships between surface roughness,grinding force,grinding temperature,and related parameters.The results indicate that the proposed grinding method leads to smaller chip sizes,lower grinding forces and temperatures,and an average reduction of 19.2%in surface roughness compared to conventional grinding.The axial,tangential,and normal grinding forces were reduced by roughly 10.5%,37.8%,and 23.0%,respectively.The optimized process parameters were determined to be N=2500 r/min,vf=30 mm/min,a=10μm,E=15 V,f=5000 Hz,dc=80%,resulting in a surface roughness of 0.161μm.

关 键 词：Dry electrical discharge assisted grinding SiCp/Al composite Surface quality Grinding force Grinding temperature 

分 类 号：TG580.6[金属学及工艺—金属切削加工及机床]