Effect of trace cerium addition on hot deformation behavior of ultrahigh-purity copper containing sulfur  

微量稀土铈对含硫纯铜热变形行为的影响

作　　者：Ke-xing SONG Yun-xiao HUA Hai-tao LIU Yan-min ZHANG Chao-min ZHANG Yan-jun ZHOU Tao HUANG 宋克兴;华云筱;刘海涛;张彦敏;张朝民;周延军;皇涛(河南科技大学材料科学与工程学院,洛阳471023;河南省科学院材料研究所,郑州450046;有色金属新材料与先进加工技术省部共建协同创新中心,洛阳471023)

机构地区：[1]School of Materials Science and Engineering,Henan University of Science and Technology,Luoyang 471023,China [2]Institute of Materials,Henan Academy of Sciences,Zhengzhou 450046,China [3]Provincial and Ministerial Co-construction of Collaborative Innovation Center of Nonferrous New Materials and Advanced Processing Technology,Luoyang 471023,China

出　　处：《Transactions of Nonferrous Metals Society of China》2025年第3期888-901,共14页中国有色金属学报(英文版)

基　　金：financially supported by the National Natural Science Foundation of China(Nos.52071133,U21A2051);the Henan Province Science and Technology Tackling Key Problems Project,China(No.222102230001);the Zhongyuan Scholar Workstation Funded Project,China(No.224400510025);the Henan Key Research and Development Project,China(No.221111230600);Luoyang Major Science and Technology Innovation Special Project,China(No.2201017A)。

摘　　要：The effects of trace cerium(Ce)addition on the microstructural and textural evolution and the dynamic recrystallization(DRX)of the ultrahigh-purity copper(Cu)containing small amounts of sulfur(S)were investigated using a Gleeble-1500 thermal simulation tester at 600°C.The results show that with increasing Ce content,the grain size of the Cu-S(S2)alloy gradually decreases and the grain boundary embrittlement induced by S impurities is considerably inhibited.The addition of Ce promotes the DRX process of the S2 alloy and changes its DRX mechanism from discontinuous to continuous and twinning-induced DRX mechanisms.The texture component and intensity of the S2 alloy vary with the increase of Ce content.The addition of 120×10^(-6) Ce(mass fraction)is favorable for the grain orientation randomization,which is attributed to the promoted DRX.采用Gleeble-1500热模拟试验机在600℃条件下进行热压缩变形,研究微量Ce添加对含微量硫纯铜组织和织构演化以及动态再结晶的影响。结果表明,随着Ce含量的增加,Cu-S(S2)合金的晶粒尺寸逐渐减小,由杂质元素S引起的晶界脆化得到显著抑制。Ce的添加促进了S2合金的动态再结晶过程,其动态再结晶机制由不连续转变为连续和孪晶诱导共存机制。S2合金的织构组分和强度随Ce含量的增加而发生改变,当Ce的添加量为120×10^(-6)时,合金晶粒取向更为随机化,这是由于动态再结晶的促进作用。

关 键 词：Ce addition S impurities ultrahigh-purity copper microstructure dynamic recrystallization texture 

分 类 号：TG1[金属学及工艺—金属学]