新型片上多光谱光电探测器的研究进展(内封面文章·特邀)  

Research progress of novel on-chip multispectral photodetectors(inner cover paper·invited)

作　　者：马英骁 李子园 MA Yingxiao;LI Ziyuan(Beijing Institute of Technology,Key Laboratory of Photoelectronic Imaging Technology and Systems of Ministry of Education,Beijing 100081,China;Beijing Institute of Technology,School of Optics and Photonics,Beijing 100081,China)

机构地区：[1]北京理工大学光电成像技术与系统教育部重点实验室,北京100081 [2]北京理工大学光电学院,北京100081

出　　处：《红外与激光工程》2025年第3期35-57,I0001,共24页Infrared and Laser Engineering

基　　金：国家自然科学基金项目(62305023);中央高校基本科研业务费专项资金资助(2023CX02002);北京理工大学青年教师学术启动计划项目(XSQD-6120220215)。

摘　　要：多光谱光电探测器可以捕获和解析物体在多个光谱波段的反射或发射信息,具有出色的目标细节辨别能力,因而被广泛应用于遥感、人脸识别、生物成像等领域。然而,传统的多光谱光电探测器在实现其功能的同时,也暴露出其局限性。它们往往依赖于滤波片等复杂的光学元件,不仅增加了系统的复杂性和维护难度,还使得探测器体积庞大,难以适应日益增长的微型化、集成化需求。同时,光谱响应范围受限也制约了其更广泛的应用潜力。随着微纳加工技术和计算成像技术的飞速进步,越来越多的片上集成式多光谱光电探测器应运而生。这些探测器通过先进的微纳加工/生长工艺,将原本复杂的光学元件集成到微小的芯片上,实现了系统的大幅简化和体积的显著缩小。文中介绍了多光谱光电探测器的基本原理,探讨了新型片上多光谱光电探测器的研究进展及应用前景。从当前的科研动态到未来的发展趋势,从技术创新到实际应用,都进行了深入的剖析和展望,并针对目前多光谱探测器存在的主要问题提供了可行性分析和建议。综上所述,新型片上多光谱光电探测器以其独特的优势和广阔的应用前景,正成为光学技术领域研究的热点。Significance Multispectral imaging technology has made significant progress in photodetection due to its highdimensional information.This progress is driven by two factors:innovations in multispectral technology combined with the development of interdisciplinary fields such as materials science,nanotechnology,and artificial intelligence,which have transformed multispectral technology from traditional to novel detection techniques.The spectral splitting methods of novel detectors have transitioned from macro-scale to micro-scale,leading to enhanced performance that surpasses traditional systems.The demand for miniaturized,lightweight detectors has further accelerated the development of on-chip multispectral photodetectors.Recent innovations in high-integration and high-sensitivity methods and materials have laid a solid foundation for future on-chip multispectral technologies.It is clear that multispectral photodetectors will evolve from large-scale systems to onchip designs,highlighting the significance of this survey on multispectral photodetectors.Progress First,the spectral splitting methods of multispectral photodetectors are introduced,which can be categorized into three types:dispersion-based,filter-based,and interference-based methods.These methods typically rely on large discrete optical components,such as gratings,triangular prisms,large-aperture lenses,and multiple sets of filters.However,these components often suffer from poor stability and are difficult to integrate,which increases the overall volume and complexity of the system.As a result,such designs deviate from the current trend toward miniaturization in multispectral photodetection.In contrast,the new generation of on-chip multispectral detectors offers greater flexibility in light splitting.These detectors either utilize ultra-thin or pixelbased splitting surface arrays that can be directly integrated with the detector or employ innovative optoelectronic materials that simultaneously function as both photosensitive and spectroscopic components.

关 键 词：多光谱 光电探测器 片上集成 超表面 纳米线 深度学习 

分 类 号：TN215[电子电信—物理电子学]