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作 者:李晓军 陈平 王冲 LI Xiaojun;CHEN Ping;WANG Chong
机构地区:[1]深圳市航盛电子股份有限公司,广东深圳518000
出 处:《科技创新与应用》2025年第10期22-27,33,共7页Technology Innovation and Application
摘 要:智能座舱域控制器要实现对多个硬件进行控制和管理,需要比较高的算力,芯片数据计算处理负荷大,容易发生故障,且芯片功率一般较高,在芯片工作时会产生大量的热积聚,导致散热不良。该文开发一种基于双控制卡的智能座舱域控制器及控制系统,通过含有SoC芯片的核心板控制卡对各车载子系统的大量数据进行计算和处理,通过含有MCU芯片的主板控制卡进行电源管理和状态监控,同时实现与其他域控制器之间的通信。MCU芯片减轻SoC芯片的负荷,通过核心板和主板控制卡的共同控制和管理,减轻单块控制卡及相应芯片的数据处理和散热负荷,有利于将各车载硬件集成以实现整合控制管理,提高汽车的智能化程度。同时采用多个散热结构设计,使域控制器中的各芯片在严苛的80℃下可以正常工作。Smart cockpit domain controllers need to control and manage multiple hardware,which requires relatively high computing power.The chip data calculation and processing load is heavy and is prone to failures.Moreover,the chip power is generally high,which will generate a large amount of heat when the chip is working.Accumulate,resulting in poor heat dissipation.This paper develops a smart cockpit domain controller and control system based on dual control cards.A core board control card containing SoC chips calculates and processes a large amount of data from each vehicle-mounted subsystem,and a motherboard control card containing MCU chips performs power management and status monitoring,while realizing communication with other domain controllers.The MCU chip reduces the load on the SoC chip.Through the joint control and management of the core board and the motherboard control card,the data processing and heat dissipation load on the single control card and the corresponding chip is reduced,which is conducive to the integration of various vehicle-mounted hardware to achieve linkage control management and improve the intelligence of the car.At the same time,multiple heat dissipation structure designs are adopted to enable each chip in the domain controller to work normally at the harsh temperature of 80℃.
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