热电制冷片焊料层失效分析及寿命预测  

The failure analysis and lifetime prediction of the solder layer in thermoelectric cooling modules

作　　者：李茹 张景双[1] 铁瑛[1] 王壮飞 赵华东[1] Li Ru;Zhang Jingshuang;Tie Ying;Wang Zhuangfei;Zhao Huadong(College of Mechanical and Power Engineering,Zhengzhou University,Zhengzhou 450001,China)

机构地区：[1]郑州大学机械与动力工程学院,郑州450001

出　　处：《低温与超导》2025年第2期79-87,共9页Cryogenics and Superconductivity

基　　金：河南省重点研发专项(231111210100)资助。

摘　　要：随着电子设备的不断普及,热电制冷片(Thermoelectric coolers, TEC)的应用日趋广泛,然而其长时间在功率循环下工作,将面临可靠性降低甚至失效的问题。为进一步研究TEC在经历功率循环时的失效机理和规律,本文基于Anand模型和Coffin-Manson模型建立了TEC的三维多物理场有限元仿真模型并加以验证,分析了焊料层厚度对TEC制冷性能及可靠性的影响得出最佳厚度,并研究了空洞分布位置对TEC可靠性和制冷性能的影响规律及其机理。结果表明,0.22 mm是合理的焊料层厚度选择,当空洞出现在边角和冷端时,焊料的等效黏塑性变形显著增加,导致TEC的可靠性大幅下降。With the increasing popularity of electronic devices,the application of thermoelectric coolers(TEC)has become increasingly widespread.However,prolonged operation under power cycling can lead to reduced reliability and even failure.Therefore,it is essential to conduct in-depth research into the failure mechanisms and patterns.First,this paper established and validated a three-dimensional multiphysics finite element simulation model of TEC based on the Anand model and Coffin--Manson model.Next,the impact of solder layer thickness on the cooling performance and reliability of TEC was analyzed to de-termine the optimal thickness.Furthermore,the effects and mechanisms of void distribution locations on the reliability and cool-ing performance of TEC were studied.The results indicate that a solder layer thickness of 0.22 mm is the most reasonable choice.When voids appear at the corners and the cold end,the equivalent viscoplastic deformation of the solder significantly in-creases,leading to a substantial decrease in TEC reliability.

关 键 词：热电制冷片 功率循环寿命 焊料厚度 空洞位置 失效循环 

分 类 号：TB302[一般工业技术—材料科学与工程]