保温板界面黏结性能研究进展  

RESEARCH PROGRESS ON THE INTERFACE BONDING PERFORMANCE OF INSULATION BOARDS

作　　者：贺月 郭松林 HE Yue;GUO Songlin(School of Civil Engineering,Qingdao University of Technology,Shandong Qingdao 266033,China)

机构地区：[1]青岛理工大学土木工程学院,山东青岛266033

出　　处：《低温建筑技术》2025年第3期59-64,共6页Low Temperature Architecture Technology

基　　金：国家自然科学基金青年项目(12002180)。

摘　　要：保温板因其良好的隔热性能和经济性,广泛应用于建筑外墙。受施工质量、雨雪冻融作用及风荷载等诸多因素导致保温板和基底间黏结界面失效,引发保温板脱落问题。为探究保温板与基底界面黏结性能,文中基于聚苯板(EPS)和挤塑板(XPS)的建筑外墙非复合及复合保温板,在拉伸剪切试验下界面黏结性能研究现状进行梳理总结,探讨主要影响因素并作出进一步分析。设计优化拉伸试验方案,为更加准确地模拟实际使用条件下保温板与基底界面的力学行为提供借鉴。Insulation boards are widely used in building exterior walls due to their excellent thermal insulation performance and cost-effectiveness.However,factors such as construction quality,freeze-thaw cycles caused by rain and snow,and wind loads can lead to adhesive interface failure between the insulation board and the substrate,resulting in detachment issues.To investigate the adhesive performance of the insulation board-substrate interface,this paper reviews and summarizes the current research on the interface bonding performance of expanded polystyrene(EPS)and extruded polystyrene(XPS)insulation boards,both composite and non-composite,under tensile-shear tests.The main influencing factors are discussed and further analyzed.An optimized tensile test scheme is designed to more accurately simulate the mechanical behavior of the insulation board-substrate interface under actual service conditions,providing a reference for future studies.

关 键 词：保温板 界面黏结性能 最大承载力 界面强度抗拉 

分 类 号：TU502[建筑科学—建筑技术科学]