电子设备热管理研究及优化方案  

Thermal Management Research and Optimization Scheme for Electronic Devices

作　　者：胡云韬 Yuntao Hu(School of Energy and Power Engineering,University of Shanghai for Science and Technology,Shanghai)

机构地区：[1]上海理工大学能源与动力工程学院,上海

出　　处：《建模与仿真》2025年第2期785-795,共11页Modeling and Simulation

摘　　要：本研究针对高功率密度和设备小型化背景下的电子设备热管理问题,提出了一种基于新型导热材料和多物理场耦合的优化方案。通过理论分析、实验验证和数值模拟相结合,评估了不同热管理策略的有效性。研究结果表明,采用石墨烯导热复合材料显著提升了设备的散热效率。本研究为电子设备的热设计提供了新的思路和解决方案。This study addresses the thermal management challenges faced by electronic devices in the context of high power density and miniaturization.A thermal management optimization scheme based on novel thermal materials and multiphysics coupling is proposed.Through a combination of theoretical analysis,experimental validation,and numerical simulation,the effectiveness of different thermal management strategies is evaluated.The results show that the use of graphene-based thermal composites significantly improves heat dissipation efficiency.This study provides new insights and solutions for the thermal design of electronic devices.

关 键 词：电子设备 热管理 石墨烯导热材料 多物理场耦合 优化方案 

分 类 号：TN03[电子电信—物理电子学]