基于SSA-VMD-DTW的绝缘子脱黏缺陷成像  

Imaging of insulator debonding defect based on SSA-VMD-DTW

作　　者：周志鹏 陈友兴[1] 王召巴[1] 逯丰亮 ZHOU Zhipeng;CHEN Youxing;WANG Zhaoba;LU Fengiang(School of Information and Communication Engineering,North University of China,Taiyuan 030051,China)

机构地区：[1]中北大学信息与通信工程学院,太原030051

出　　处：《无损检测》2025年第3期55-61,共7页Nondestructive Testing

基　　金：山西省自然科学基金项目(20210302124202);国家自然基金联合基金重点支持项目(U23A20636)。

摘　　要：复合绝缘子的高声衰减性和黏接结构特殊性会导致C扫描图像中出现异常高亮区域,为了有效消除其对自动化判别的影响,提出一种基于SSA-VMD-DTW算法的C扫描成像方法。首先,采集了3组不同距离的信号,分析对比3组原始数据的脱黏信号、界面信号和异常高亮信号,其信号差别能够明显区分;然后,对原始信号进行SSA-VMD模态分解去噪,计算IMF2分量与标准参考信号的DTW距离,将得到的相关系数矩阵与原始C扫描图像进行加权处理。试验结果表明,该方法可有效消除C扫描图像中的异常高亮区域,为后续的自动化缺陷判别奠定基础,同时也为相似结构工件的脱黏缺陷检测提供一种成像思路。The high attenuation of composite insulator and the specificity of bonding structure will lead to abnormal highlight area in C-scan images.In order to effectively eliminate its influence on automatic discrimination,a C-scan imaging algorithm based on SSA-VMD-DTW was proposed.First,three groups of original signals at different distances were collected.The de-bonding signals,interface signals and abnormal highlight signals of the three groups of original data were analyzed and compared,which could clearly distinguish the signal differences.Then,the original signal was denoised by SSA-VMD mode decomposition,and the DTW distance between the IMF2 component and the standard reference signal was calculated,and the correlation coefficient matrix was obtained and weighted with the original C-scan images.Experimental results showed that the proposed method could effectively eliminate the abnormal highlights in C-scan images,and it laid a foundation for the automatic defect identification and provided an imaging idea for the defect detection of similar components.

关 键 词：复合绝缘子 相控阵超声 脱黏缺陷 麻雀搜索算法 变分模态分解 动态时间规整 

分 类 号：TB553[理学—物理] TG115.28[理学—声学]