Electric-assisted diffusion bonding of Al_(0.3)CoCrFeNi high-entropy alloys:mechanisms and properties  

作　　者：Mengchun Fu Jia Yang Jinze Lyu Panpan Lin Tiesong Lin Peng He 

机构地区：[1]State Key Laboratory of Precision Welding&Joining of Materials and Structures,Harbin Institute of Technology,Harbin 150001,China

出　　处：《China Welding》2025年第1期1-11,共11页中国焊接(英文版)

基　　金：support from National Natural Science Foundation of China(NSFC,Grant numbers U22A20185,U21A20128,52175302 and 52305353);Aeronautical Science Foundation(ASFC-20230036077001);Fundamental Research Funds for the Central Universities(2022FRFK060009,HIT.DZI1.2023012).

摘　　要：The excellent irradiation resistance,high strength and plasticity exhibited by high-entropy alloys(HEAs)make it candidate for engin-eering applications.Diffusion bonding of Al_(0.3)CoCrFeNi single-phase HEAs was carried out using electric-assisted diffusion bonding(EADB),and the effect of bonding temperature on the evolution of the interfacial microstructure and the mechanical properties was investigated.The results indicate that as the bonding temperature increases,the pores at the interface gradually decrease in size and undergo closure.The electric current significantly promotes the pore closure mechanism dominated by plastic deformation at the diffusion interface and promotes the recrystallisation behavior at the interface,and the fracture mode changes from intergranular fracture at the interface to jagged fracture along the grains spanning the weld parent material.Due to the activation effect of EADB,higher-strength diffusion bonding of high-entropy alloys can be achieved at the same temperature compared with the conventional hot-pressure diffusion bonding(HPDB)process.

关 键 词：High-entropy alloys Electric-assisted diffusion bonding Bonding mechanism Interfacial pore closure Shear strength 

分 类 号：TG456.7[金属学及工艺—焊接]