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作 者:Shu Zheng Fulin Hao Youcun Lu Tingting Jiang Xudong Yang
机构地区:[1]Department of Building Science,Tsinghua University,Beijing,100084,China [2]China Nuclear Power Technology Research Institute Co.,Ltd,Shenzhen,518000,China [3]Shanxi Research Institute for Clean Energy,Tsinghua University,Taiyuan,030032,China
出 处:《Building Simulation》2025年第2期281-293,共13页建筑模拟(英文)
基 金:funded by the China Postdoctoral Science Foundation(2024M751701).
摘 要:The presence of walls’thermal defects can lead to large deviations between predicted and actual values of energy consumption.Infrared images have been used to compare the differences in U-value(heat transfer coefficient)and heat flow between defect and normal building walls.However,the extent to which different defects affect the U-value of building walls remains to be investigated.This study proposes a method for evaluating the impact of various defects on the U-value of building wall envelopes.Infrared images were acquired for a building in Beijing,China to demonstrate the method.First,the accuracy of the method for measuring heat flow through building walls was validated using the heat flow meter method.Second,the K-means method was applied to classify wall pixel temperatures and to identify defects of building walls.The area and boundary of defects were got.Then,the validated infrared method was used to calculate the U-value for different defects.Finally,the difference in heat transfer coefficients(ΔU_(sd))was used to evaluate the impact of various defects on the building wall.The results indicated that variations in the area and temperature of defects contributed differently to the wall’s U-value.The maximum difference between the U-value of the repaired defect and the unrepaired wall is 0.42 W/(m^(2)·K).The method proposed in this study quantitatively assesses the extent to which defects affect the U-value of a building wall,providing reference data for making decisions regarding wall renovation.
关 键 词:infrared thermography thermal defects heat transfer coefficient K-means algorithm thermal defect quantification
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