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作 者:王宇 杨超 曹洪志 屈杰 WANG Yu;YANG Chao;CAO Hongzhi;QU Jie(Box 429,Chadianzi,Chengdu 610036,China)
机构地区:[1]成都市茶店子429信箱,四川成都610036
出 处:《电子质量》2025年第3期74-77,共4页Electronics Quality
摘 要:电子设备对工艺类相关材料的可替代性要求越来越高,由单一厂家供货会导致依赖性较强、断供风险大,对电子设备的产出有较大影响。针对一种单组份硅脂导电胶开展替代验证研究,进行目标材料的指标分析、同类材料调研、体制验证和应用验证,关注工艺控制的关键点。最终完成该材料的替代验证,实现了备份,降低了供应链风险。同时,为其他相关材料提供了替代验证思路和方法。The demand for substitutability of process-related materials in electronic equipment is increasing.Relying on a single supplier can lead to strong dependency and significant risks of supply disruption,which greatly impacts the production of electronic equipment.The substitution verification study is conducted on a single-component silicone-based conductive adhesive,including analysis of target material specifications,research on similar materi-als,system verification,and application verification.The key points of process control are focused on.Ultimately,the substitution verification of this material is completed,the backup solution is achieved and the supply chain risks is reduced.Additionally,a framework and methodology for the substitution verification of other related materials is pro-vided.
分 类 号:TN604[电子电信—电路与系统]
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