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作 者:韩立新 李广斌 李志强 王淑叶 庄思杰 龙柱[3] HAN Lixin;LI Guangbin;LI Zhiqiang;WANG Shuye;ZHUANG Sijie;LONG Zhu(Lianyungang Gongtou Fiber and Composite Material Inspection and Testing Center Co.,Ltd.,Lianyungang 222042,Jiangsu,China;Lianyungang Fiber New Material Research Institute Co.,Ltd.,Lianyungang 222042,Jiangsu,China;College of Textile Science and Engineering,Jiangnan University,Wuxi 214122,Jiangsu,China)
机构地区:[1]连云港工投纤维与复合材料检验检测中心有限公司,江苏连云港222042 [2]连云港纤维新材料研究院有限公司,江苏连云港222042 [3]江南大学纺织学院,江苏无锡214122
出 处:《高科技纤维与应用》2025年第1期25-33,共9页Hi-Tech Fiber and Application
摘 要:为降低绝缘纸板劣化风险并拓宽非木浆绝缘纸板应用,本文以不同型号聚酰亚胺短切纤维为原料,制备聚酰亚胺绝缘纸板(PI绝缘纸板)。通过在浆料中添加分散剂聚氧化乙烯(PEO)、增强剂阳离子聚丙烯酰胺(CPAM)及羧基丁苯胶乳,并与芳纶浆粕混抄制备原纸,经不同树脂浸渍及多层复合热压结合,获得力学、电气性能优良的PI绝缘纸板。结果表明,当芳纶浆粕用量为6.0%、PEO用量为0.06%、丁苯胶乳用量8.0%,选用K0506型号(细度更小)聚酰亚胺短切纤维,聚酰亚胺树脂浸渍浓度4.0%,热压条件为200℃、5 MPa、5 min时,所制备定量为120 g/m^(2)绝缘纸板的抗张指数达39.996 N·m/g,撕裂指数为43.208 mN·m^(2)/g,挺度为1.424 mN·m,击穿强度为4.471 kV/mm。SEM图显示,热压后纸板表面树脂覆盖均匀,且分解温度Tmax高达616℃,可长期在高温环境下保持优异稳定性。To reduce the risk of insulation board degradation and expand the application of non-wood pulp insulating boards,this study utilized different polyimide(PI)short-cut fibers as raw materials to prepare polyimide insulating boards(PI insulating boards).By incorporating polyethylene oxide(PEO)as a dispersant,cationic polyacrylamide(CPAM)as a reinforcing agent,and carboxylated styrene-butadiene latex into the pulp,followed by co-forming with aramid pulp to produce base paper,and subsequently impregnating with various resins and undergoing multilayer composite hot pressing,PI insulating boards with excellent mechanical and electrical properties were obtained.The results indicated that under optimized conditions-6.0%aramid pulp,0.06%PEO,8.0%styrene-butadiene latex,K0506-grade PI fibers(finer diameter),4.0%polyimide resin impregnation concentration,and hot pressing at 200℃,5 MPa for 5 min-the prepared insulating board with a basis weight of 120 g/m^(2) achieves a tensile index of 39.996 N·m/g,a tear index of 43.208 mN·m^(2)/g,a stiffness of 1.424 mN·m,and a breakdown strength of 4.471 kV/mm.SEM images reveal that the resin is evenly distributed on the surface after hot pressing,and the decomposition temperature(T_(max))reaches as high as 616℃,ensuring excellent stability under prolonged high-temperature conditions.
关 键 词:聚酰亚胺 绝缘纸板 树脂浸渍 热压工艺 耐温性能
分 类 号:TB324[一般工业技术—材料科学与工程]
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