微晶与粗晶磷铜球阳极组织结构及电化学溶解性能比较研究  

Comparative study on microstructure and electrochemical dissolution properties of microcrystalline and macrocrystalline copper-phosphorus sphere anodes

作　　者：毛海娜 张清龙 赵一杭 白辰兴 郭永年 王贵平 柳建东 雷顺玲 王云香 Mao Haina;Zhang Qingong;Zhao Yihang;Bai Chenxing;Guo Yongnian;Wang Guiping;LiuJiandong;Lei Shuning;Wang Yunxiang(Jinchang Niedu Mining Industry Co.,Ltd.,Jinchang 737100,China)

机构地区：[1]金昌镍都矿山实业有限公司,甘肃金昌737100

出　　处：《电镀与精饰》2025年第4期20-25,共6页Plating & Finishing

摘　　要：酸性镀铜工艺在印刷电路板制造领域有着广泛的应用。磷铜阳极是酸性镀铜的重要原料,其成分和组织结构对镀铜溶液和镀铜层的质量与性能有着显著的影响。本文选取了两种商用的磷铜球,利用光学显微镜、电子背散射衍射(EBSD)、X射线衍射、波谱仪等对其成分和组织结构进行详细分析,并利用电化学方法研究了两种磷铜球在典型酸性镀铜溶液中的电化学溶解行为。研究表明,微晶磷铜球相比于粗晶磷铜球,晶粒尺寸要小一个数量级,且具有更加均匀细密的磷元素分布状态。在阳极极化和恒电流极化状态下,微晶磷铜球的溶解活性均要更高。而在不受极化影响的自溶解状态下,其溶解趋势和溶解速率均更低,有利于镀液成分的稳定。Acid copper plating process has been widely used in the field of printed circuit board manufacturing.Copper-phosphorus anode is an important raw material for acidic copper plating.Its composition and structure have a significant effect on the quality and performance of copper plating solution and copper plating layer.In this paper,two kinds of commercial copper-phosphorus spheres were selected,and their composition and structure were analyzed in detail by optical microscope,electron backscatter diffraction(EBSD),X-ray diffraction and spectrometer.The electrochemical dissolution behavior of two kinds of phosphorus copper spheres in typical acidic copper plating solution was studied by electrochemical means.The results show that the grain size of microcrystalline phosphorus copper ball is one order of magnitude smaller than that of macrocrystalline copper-phosphorus ball,and it has a more uniform and fine distribution of phosphorus.In the anodic polarization state and the constant current polarization state,the dissolution activity of the microcrystalline phosphorus copper ball is higher.In the self-dissolution state that is not affected by polarization,the dissolution trend and dissolution rate are lower,which is conducive to the stability of the bath composition.

关 键 词：微晶磷铜球 粗晶磷铜球 电镀阳极 印刷电路板 溶解性能 

分 类 号：TG172.8[金属学及工艺—金属表面处理]