杂质铜离子对300M超高强度钢无氰电镀镉钛镀层性能的影响  

Effect of impurity copper ions on the performance of cadmium titanium plating without cyanide electroplating of 300M ultra-high strength steel

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作  者:谌宏 吴煜 王春霞[1] Chen Hong;Wu Yu;Wang Chunxia(College of Materials Science and Engineering,Nanchang Hangkong University,Nanchang 330063,China)

机构地区:[1]南昌航空大学材料科学与工程学院,江西南昌330063

出  处:《电镀与精饰》2025年第4期83-89,共7页Plating & Finishing

摘  要:无氰电镀镉钛工艺在航空工业领域获得了广泛的应用,然而镉钛镀液容易引入杂质铜离子,进而致使镀液呈现红色。为深度探究杂质铜离子带来的影响,通过阴极极化曲线和循环伏安曲线测试镀液的阴极过程,借助场发射电子显微镜以及X射线衍射仪对镀层的微观结构予以了分析,运用塔菲尔曲线剖析了镀层的耐蚀性,并且通过渗氢曲线和钛含量测试解析了镀层的抗氢脆性能。其结果显示:杂质铜离子会让镀层表面趋向粗糙,一旦镀液中的杂质铜离子浓度超出0.078 g/L,镀层的晶粒尺寸就会增大,镀层中的钛含量降低,镀层的耐蚀性会陡然下降,抗渗氢的能力也会随之减弱。The cyanide-free cadmium-titanium plating process has been widely used in the aviation industry.However,cadmium-titanium plating solution is prone to introduce impurity copper ions,which in turn causes the bath to appear red.In order to deeply explore the influence of impurities of copper ions,the cathode process of the plating solution was tested by cathodic polarization curve and cyclic voltammetry curve,the microstructure of the coating was analyzed by field emission electron microscopy and X-ray diffractometer,the corrosion resistance of the coating was analyzed by the Tafel curve,and the hydrogen embrittlement resistance of the coating was analyzed by the hydrogen infiltration curve and titanium content test.The results show that the impurity copper ions will make the surface of the coating rougher,and once the concentration of impurity copper ions in the plating solution exceeds 0.078 g/L,the grain size of the coating will increase,the titanium content in the coating will decrease,the corrosion resistance of the coating will decrease sharply,and the resistance to hydrogen permeation will also be weakened.

关 键 词:杂质铜离子 镉钛合金 耐蚀性 氢脆 

分 类 号:TQ153.1[化学工程—电化学工业]

 

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