杂质离子对电镀镍金金面粗糙的影响  

Research on the effect of impurity ions on the roughness of gold surface in nickel gold electroplating

作　　者：彭锦强 涂敏 李雅军 PENG Jingqiang;TU Min;LI Yajun(Greatech Substrate Co.,Ltd.,Guangzhou 510700,Guangdong,China)

机构地区：[1]广州广芯封装基板有限公司,广东广州510700

出　　处：《印制电路信息》2025年第4期12-16,共5页Printed Circuit Information

摘　　要：分析电镀镍金流程中引入不同杂质离子对镀层晶格变化的影响。当总有机碳(TOC)含量超过20 mg/L时,镍层晶格发生突变,进而造成金面粗糙缺陷。不同有机物质的溶出对镍层晶格生长影响程度存在差异,其中有机干膜的溶出影响最大。在引入不同金属离子的影响测试中,金属活泼性和电负性顺序越高于镍离子,越易引发镍层晶格变异,进而导致金面粗糙。In this paper,the process of nickel and gold electroplating was analyzed,and the effect of different introducers on the lattice change of the plating was discussed.When the TOC content exceeds 20mg/L,the lattice of the nickel layer undergoes a sudden change,which leads to the appearance of rough gold surface defects.The dissolution of different organic substances has varying degrees of impact on the lattice growth of nickel layers,with the dissolution of organic dry films having the greatest impact.In the impact testing of introducing different metal ions,the higher the order of metal activity and electronegativity compared to nickel ions,the more likely it is to cause lattice variation in the nickel layer,resulting in rough gold surface.

关 键 词：电镀 金面粗糙 总有机碳 金属离子 晶格 

分 类 号：TN41[电子电信—微电子学与固体电子学]