荧光显微镜光学检测方法在挠性印制电路板的应用  

Application of fluorescence microscope optical detection method for flexible printed circuit

作　　者：吴越 曹建诚 吴义涛 韩云丽 WU Yue;CAO Jiancheng;WU Yitao;HAN Yunli(Yancheng Weixin Electronics Co.,Ltd.,Yancheng 224056,Jiangsu,China)

机构地区：[1]盐城维信电子有限公司,江苏盐城224056

出　　处：《印制电路信息》2025年第4期46-49,共4页Printed Circuit Information

摘　　要：随着挠性印制电路板(FPCB)行业的高速发展,提高产品的产量、品质及其光学检测效率有助于提升企业核心竞争力。将一种新型荧光显微镜光学检测方法用于挠性印制电路板的制程监测,相较于现有普通显微镜技术,荧光显微镜具有独特优势。使用荧光显微镜可清晰观测FPCB制程中铜面上较小且透明残留物,如异物残留、溢胶监测及盲孔底部胶渣残留判断等,从而可简便快捷管控FPCB品质。因此,上述方法具有较强实用性,经济效益显著。With the rapid development of FPC flexible circuit board industry,improving optical inspection efficiency,product output and quality helps to improve the company's core competitiveness.In this paper,a new optical inspection method of fluorescence microscope is provided for the process monitoring of flexible printed circuit board(FPCB).Compared with the existing ordinary microscope technology,fluorescence microscope has a unique advantage.Fluorescence microscopy can be used to clearly observe small and transparent residues on the copper surface of the FPCB process,such as foreign body residue,glue spill monitoring and glue residue determination at the bottom of the blind hole,which can be simple and fast to observe the quality of FPCB,with strong practicability and significant economic benefits.

关 键 词：荧光显微镜 光学检测 挠性印制电路板 

分 类 号：TN41[电子电信—微电子学与固体电子学]