半挠性刚挠印制板制造工艺研究  

Research on the manufacturing method of semi flexible R-FPCB process

作　　者：黄建波 孙彭 翟新龙 张大国 HUANG Jianbo;SUN Peng;ZHAI Xinlong;ZHANG Daguo(Shanghai Fast-PCB Circuit Technology Co.,Ltd.,Shanghai 201815,China)

机构地区：[1]上海嘉捷通电路科技股份有限公司,上海201815

出　　处：《印制电路信息》2025年第4期56-59,共4页Printed Circuit Information

摘　　要：根据不同类型的半挠性材料,通过引入垫片阻胶技术及优化成品控深揭盖工艺,对半挠性刚挠印制板的制造工艺展开研究,最终确立一套完善的半挠性刚挠印制板生产工艺流程。该工艺流程可有效解决生产过程中遇到的技术难题,确保产品质量达标并按时交付,以满足客户使用需求。This article studies the selection of different Semi-flexible materials,the addition of spacer for adhesive flow prevention during lamination press,and the process of controlling the depth and the protection shield opening on finished PCBs.Finally,the production process of Semi-flexible PCB is determined,which solves the problems in the production process of Semi-flexible PCBs,ensures timely and high-quality delivery of products,and meets the needs of customers.

关 键 词：半挠性刚挠印制板 控深铣 揭盖工艺 

分 类 号：TN41[电子电信—微电子学与固体电子学]