六方氮化硼对碳氢树脂/SiO_(2)粘结片导热性能的影响  

Effect of Hexagonal Boron Nitride on Thermal Conductivity of Hydrocarbon Resin/SiO_(2)Bonding Sheet

作　　者：李强[1] 金霞 冯春明 王维文 LI Qiang;JIN Xia;FENG Chunming;WANG Weiwen(The 46th Research Institute of China Electronics Technology Group Corporation,Tianjin 300220,China)

机构地区：[1]中国电子科技集团公司第四十六研究所,天津300220

出　　处：《塑料》2025年第2期19-22,27,共5页Plastics

摘　　要：散热是多层电路板设计中的关键性问题,其严重阻碍了器件向高功率化、高集成化和小型化方向的发展。因此,将不同含量的六方氮化硼加入碳氢树脂中,采用浸渍工艺制备碳氢树脂/SiO_(2)粘结片,研究不同的六方氮化硼含量对碳氢树脂/SiO_(2)粘结片的微观形貌、密度、导热性能及力学性能的影响。结果表明,随着六方氮化硼含量的提高,粘结片的热导率呈现上升的趋势,密度、力学强度均呈现先升高后下降的趋势。当六方氮化硼的含量为6%时,碳氢树脂/SiO_(2)粘结片的微观缺陷较少,具有较高的密度和力学强度,同时具有较好的导热性能,其密度为1.436 g/cm^(3),力学强度为12.6 MPa,热导率为1.16 W/(m·K),碳氢树脂/SiO_(2)粘结片的散热能力得到提高。Heat dissipation was a critical issue in multilayer circuit board design,which seriously hindered the development of devices to high power,high integration,and miniaturization.Herein,the hydrocarbon resin/SiO_(2)bonding sheet were prepared by dipping process and sintering at high temperature.The effects of different h-BN contents on the microstructure,density,thermal conductivities,and mechanical property of hydrocarbon resin/SiO_(2)bonding sheet were researched.The results showed that the thermal conductivity of the bonding sheet increases with the increase of h-BN content,and the density,tensile strength increases first and then decrease.When the content of h-BN was 6%,the hydrocarbon resin/SiO_(2)adhesive sheet had the least microscopic defects,the highest density and mechanical strength,and the ideal thermal conductivity.Its density was 1.436 g/cm^(3),mechanical strength was 12.6 MPa,and thermal conductivity was 1.16 W/(m·K).Adding h-BN to the hydrocarbon resin/SiO_(2)binder was expected to improve its heat dissipation.

关 键 词：六方氮化硼 碳氢树脂 复合材料 导热性能 力学性能 

分 类 号：TQ321.2[化学工程—合成树脂塑料工业]