Cr和Zr对CuW/CuCr整体材料界面组织与性能的影响  

Effects of Cr and Zr on Interface Microstructures and Properties of CuW/CuCr Integral Materials

作　　者：杨晓红[1] 刘子贤 李雪健[1] 肖鹏[1] 梁淑华[1] Yang Xiaohong;Liu Zixian;Li Xuejian;Xiao Peng;Liang Shuhua(Xi’an University of Technology,Xi’an 710048,China)

机构地区：[1]西安理工大学,陕西西安710048

出　　处：《稀有金属材料与工程》2025年第3期774-780,共7页Rare Metal Materials and Engineering

基　　金：国家自然科学基金(52274366)。

摘　　要：采用整体烧结熔渗法制备了含Cu-Cr-Zr粉末夹层的CuW/CuCr整体材料,研究了Cr和Zr含量、固溶时效热处理对界面及两侧材料组织与性能的影响。结果表明,随着Cu-15%Cr-x%Zr(质量分数)夹层中Zr含量的增加,整体材料CuCr侧共晶相增多,CuCr端导电率有所下降;硬度呈先升高后降低的变化趋势。同时Zr元素的添加促进了Cr元素向W中扩散。制备了含不同成分夹层的整体材料拉伸试棒,测试其界面抗拉强度并分析了断口形貌。发现夹层中Zr含量在0.5%时,整体材料界面抗拉强度达到最大值517 MPa,与未添加Zr的含Cu-15%Cr夹层的CuW/CuCr整体材料相比提高了18%,拉伸断口中Cu相撕裂棱变浅变短,W颗粒发生解理断裂的数量增多,表明Cu/W相界面和CuCr端强度均得到了提高。CuW/CuCr integral materials with Cu-Cr-Zr powder interlayer was prepared by integral sintering infiltration method.The effects of Cr and Zr content and solution aging heat treatment on the microstructure and properties of the interface and both sides of the material were studied.The results show that with the increase in Zr content in Cu-15%Cr-x%Zr(mass fraction,similarly hereinafter)interlayer,the eutectic phase amount on CuCr side of the integral material increases,and the conductivity at CuCr end decreases.The hardness increases first and then decreases.At the same time,the addition of Zr promotes the diffusion of Cr into W.The tensile test bars of integral materials with different interlayers were prepared,and the interfacial tensile strength was tested and the fracture morphology was analyzed.It is found that when the Zr content in the interlayer is 0.5%,the interfacial tensile strength of the whole material reaches the maximum value of 517 MPa,which is 18%higher than that of the CuW/CuCr integral material with Cu-15%Cr interlayer without Zr.The tearing edge of Cu phase in the tensile fracture becomes shallower and shorter,and the number of cleavage fractures of W particles increases,which indicates that the interfacial strength of Cu/W phase and the end strength of CuCr are improved.

关 键 词：CuW/CuCr整体材料 界面组织 固溶时效处理 断口形貌 界面结合强度 

分 类 号：TB331[一般工业技术—材料科学与工程]