3D打印镍基合金亚毫米级缺陷多分辨低频超声C扫描定量检测  

Multi-resolution Low-frequency Ultrasonic C-scan Quantitative Detection of Micron-level Defects in 3D Printed Nickel Base Alloy

作　　者：马志远[1] 崔振 康达 刘晓晴 林莉[1] MA Zhiyuan;CUI Zhen;KANG Da;LIU Xiaoqing;LIN Li(NDT&E Laboratory,Dalian University of Technology,Dalian 116024;Beijing Power Machinery Institute,Beijing 100074)

机构地区：[1]大连理工大学无损检测研究所,大连116024 [2]北京动力机械研究所,北京100074

出　　处：《机械工程学报》2025年第4期24-31,共8页Journal of Mechanical Engineering

基　　金：国家自然科学基金资助项目(52175496,52075078,U22B2068)。

摘　　要：超声C扫描技术已被广泛应用于3D打印合金构件微气孔、裂纹、未熔合等缺陷的自动化检测,如何在兼顾其足够检测深度条件下提高检测分辨率和定量精度一直是研究难点。研究发展水浸聚焦探头C扫描检测的裂谱分析技术,提出一种多分辨低频超声C扫描定量检测微小缺陷的新方法,实现合金构件内亚毫米级缺陷的检测深度、分辨率和定量精度的综合提升。采用超声C扫描系统结合20MHz水浸点聚焦探头进行试验,直角型缝隙试样用于测定检测系统的多分辨能力,含有直径φ100~800μm孔隙型缺陷的3D打印镍基高温合金用于验证缺陷定量方法有效性。结果表明多分辨低频超声C扫描定量检测方法可将20 MHz点聚焦探头焦点附近横向分辨率从210μm改善到小于118μm,标称φ200μm缺陷的定量相对误差从105%提升到8%,且该方法还可使焦柱长度提升3倍以上,显著提高远焦距位置的分辨率。Ultrasonic C-scan technology is widely used in the automatic detection of defects such as sub-millimeter pores,cracks,and incomplete fusion in 3D printed alloy components.It is difficult to improve the resolution and quantitative accuracy under a large detection depth.A split spectrum processing technology for C-scan detection of water immersion point focusing probe is developed.A new method of quantitative detection of sub-millimeter defects by multi-resolution low-frequency ultrasonic C-scan is proposed by developing the crack spectrum processing technology of water immersion focusing probe C-scan detection,which realizes the comprehensive improvement of detection depth,resolution and quantitative accuracy of micron-scale defects in alloy components.Ultrasonic C-scan system combined with a 20 MHz water immersion point focusing probe is used for the experiment.The multi-resolution ability of the focusing probe is measured by a right-angle gap sample.The 3D printed nickel-based superalloy containing pore-type defects with a diameter ofφ100~800μm is used to verify the effectiveness of the proposed defect quantification method.Results indicate that the multi-resolution ultrasonic C-scan can improve the lateral resolution from 210μm to less than 118μm at the focus,and the relative error of theφ200μm defect is increased from 105%to 8%.The proposed method can also increase the length of the focal beam by nearly three times,which significantly improves the resolution of the far focal position.

关 键 词：超声C扫描 裂谱分析 镍基合金 亚毫米级缺陷 横向分辨率 

分 类 号：TQ174[化学工程—陶瓷工业]