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作 者:王毅 刘帅 雷杰 党作红 赵鹏森 高杨涛 Wang Yi;Liu Shuai;Lei Jie;Dang Zuohong;Zhao Pengsen;Gao Yangtao(Avic Forstar Science and Technology Co.,Ltd,Xi’an,710077)
机构地区:[1]中航富士达科技股份有限公司,西安710077
出 处:《航天制造技术》2025年第2期50-57,共8页Aerospace Manufacturing Technology
摘 要:本文针对高硅铝微波管壳激光封焊工艺进行优化与机理讨论,通过单因素试验和正交试验对各工艺参数进行优化,并通过SEM、EDS、金相测试和氦质谱检漏仪进行性能表征。结果表明,硅铝激光焊接熔池深度主要受峰值功率影响,而熔池宽度主要受脉冲宽度影响,得到最佳工艺参数为:峰值功率2.4 kW、脉冲宽度5 ms、脉冲频率20 Hz、焊接速度100 mm/min;离焦方式为负离焦,离焦量4 mm;脉冲波形为“预热-保温-缓冷”波形,封焊后管壳漏率为9.7×10^(-10) Pa·m^(3)/s,并对管壳进行温度循环、稳态湿热、稳态振动和温度冲击等环境试验后,漏率仍小于1×10^(-9) Pa·m^(3)/s,满足国军标要求。实现高硅铝合金良好封焊的机理为:最佳封焊工艺控制了熔池中脆性Si相晶粒的长大,分布细小均匀的Si颗粒使得焊缝具有良好的韧性与强度,从而避免焊接裂纹的产生。This article focuses on the optimization and mechanism discussion of laser sealing and welding process for high silicon aluminum microwave shells.The process parameters are optimized through single factor experiments and orthogonal experiments,and the performance is characterized by SEM,EDS,metallographic testing,and helium mass spectrometer leak detector.The results showed that the depth of the silicon aluminum laser welding melt pool was mainly affected by the peak power,while the width of the melt pool was mainly affected by the pulse width.The optimal process was obtained as follows:peak power of 2.4 kW,pulse width of 5 ms,pulse frequency of 20 Hz,welding speed of 100 mm/min,negative defocusing method,defocusing amount of 4 mm,pulse waveform of preheating insulation slow cooling waveform.After sealing,the leakage rate of the shell was 9.7×10^(-10) Pa·m^(3)/s.After temperature cycling,steady-state wet heat,steady-state vibration,and temperature shock environmental tests on the shell,the leakage rate was still less than 1×10^(-9) Pa·m^(3)/s,meeting the requirements of the national military standard.The mechanism for achieving good sealing of high silicon aluminum alloys is that the optimal sealing process controls the growth of brittle Si phase grains in the melt pool,and the evenly distributed Si particles make the weld have good toughness and strength,thereby avoiding the occurrence of welding cracks.
关 键 词:高硅铝管壳 激光焊接 工艺优化 气密性 封焊机理
分 类 号:TN454[电子电信—微电子学与固体电子学]
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