乙二醇苯醚对氢氧化钠碱性体系退膜工艺的影响研究  

Effect of Ethylene Glycol Monophenyl Ether on the Film Stripping Process of Sodium Hydroxide Alkaline System

作　　者：李立清[1,3,4] 章礼旭 杨丽钦 吴新宇[1] 黄邵卿 黄旻潇 王佳城 喻荣祥 LI Liqing;ZHANG Lixu;YANG Liqin;WU Xinyu;HUANG Shaoqing;HUANG Minxiao;WANG Jiachen;YU Rongxiang(School of Chemistry and Chemical Engineering,Jiangxi University of Science and Technology,Jiangxi Ganzhou 341000,China;School of Information Engineering,Jiangxi University of Science and Technology,Jiangxi Ganzhou 341000,China;Yichun Lithium New Energy Industry Research Institute,Jiangxi University of Science and Technology,Jiangxi Yichun 336023,China;Jiangxi Ganzhou Key Laboratory of Applied Electrochemistry,Jiangxi Ganzhou 341000,China;Jiangxi Xin Feng Zheng Tian Wei Technology Co.,Ltd.,Jiangxi Ganzhou 341600,China)

机构地区：[1]江西理工大学化学化工学院,江西赣州341000 [2]江西理工大学信息工程学院,江西赣州341000 [3]江西理工大学宜春锂电新能源产业研究院,江西宜春336023 [4]江西省赣州市应用电化学重点实验室,江西赣州341000 [5]江西省信丰正天伟电子科技有限公司,江西赣州341600

出　　处：《表面技术》2025年第8期145-155,共11页Surface Technology

基　　金：江西省自然科学基金重点项目(20224ACB203010);江西省宜春市科技项目(2023YBKJGG01);江西省高层次高技能领军人才培训工程。

摘　　要：目的 解决采用传统氢氧化钠碱性体系退膜时存在的膜渣过大、退膜不净等问题。方法 通过退膜实验研究了乙二醇苯醚对氢氧化钠退膜效果的影响,通过浸泡测试和电化学测试表征退膜液对板材表面锡镀层的腐蚀程度,并在退膜前后通过扫描电子显微镜对锡镀层表面的微观形貌进行分析,通过傅里叶变换红外光谱对退膜液的作用机理进行分析。结果 仅使用氢氧化钠进行退膜时,对线路镀层中干膜的去除效果较差,添加乙二醇苯醚可以通过减小膜渣尺寸来解决退膜不净的问题,且膜渣大小受乙二醇苯醚浓度、退膜时间等因素影响;随着退膜液中乙二醇苯醚浓度的增加,锡镀层厚度损失量减少、表面电荷转移电阻增大、腐蚀电流密度降低;锡镀层表面主要由胞状物组成,退膜液中添加乙二醇苯醚后,镀层在退膜前后的形貌结构无明显变化;退膜后的干膜相比于退膜前,其红外光谱在1 567 cm^(-1)附近出现了羧酸盐的特征吸收峰。结论 乙二醇苯醚可以解决氢氧化钠退膜时存在的膜渣过大、退膜不净等问题,且能减轻锡镀层在退膜液中的腐蚀程度;退膜液主要通过降解干膜分子中的碱溶性基团,使干膜发生溶胀,从而实现退膜的过程。In the film stripping process of printed circuit boards,the use of NaOH to remove the photoresist dry film tends to corrode the coating,and it is very easy to leave a residual film on the board surface,and the flaking film fragments are too large to be easily filtered.In order to solve the aforementioned problems,the work aims to investigate the effect of EPH on the film removal effect of NaOH by film stripping experiments,and mainly examine several aspects of performance indexes,such as stripping time and film fragment size.The degree of corrosion of the tin coating on the surface of the plates in the film stripper is evaluated by immersion tests and electrochemical tests,the micromorphology of the tin coating surface is analyzed by scanning electron microscopy,and the mechanism of action of the film stripper is investigated by Fourier transform infrared(FTIR)spectroscopy.The results show that it is difficult to remove the photoresist dry film in the line plating layer when only NaOH is used for stripping film,and the addition of EPH will inhibit the stripping rate to a certain extent,but it can be improved by reducing the size of the film fragment to solve the problem of unclean film removal,and the film fragment size is affected by the concentration of EPH,stripping time and other factors.For the extent of corrosion of protective plating(tin plating)on the surface of the circuit in the film stripper,it can be seen from the results of immersion experiments and electrochemical experiments that,as the concentration of EPH in the film stripper increases,the amount of thickness loss of the tin plating decreases,the surface charge transfer resistance increases and the corrosion current density decreases.From the SEM images,it can be observed that the surface of the tin plating is mainly composed of cellular structure substances,and the surface of the tin plating shows an obvious dissolution phenomenon after only NaOH is used for removal,while the morphology and structure of the plating layer after film stripping do

关 键 词：印刷线路板 退膜液 感光干膜 乙二醇苯醚 电镀夹膜 锡腐蚀 

分 类 号：TQ153[化学工程—电化学工业]