脉冲激光-超声复合辅助车削SiCp/Al的切屑形成演变过程分析  

Analysis of Chip Formation and Evolution Process of SiCp/Al by Pulsed Laser and Ultrasonic Composite Assisted Machining

作　　者：林洁琼[1] 解略 于行 谷岩[1] 周晓勤 LIN Jieqiong;XIE Lue;YU Hang;GU Yan;ZHOU Xiaoqin(School of Mechanical and Electrical Engineering,Changchun University of Technology,Changchun 130012,China;College of Mechanical and Aerospace Engineering,Jilin University,Changchun 130025,China)

机构地区：[1]长春工业大学机电工程学院,长春130012 [2]吉林大学机械与航空航天工程学院,长春130025

出　　处：《表面技术》2025年第8期167-179,共13页Surface Technology

基　　金：国家自然科学基金(U19A20104)。

摘　　要：目的 SiCp/Al复合材料与传统的金属材料相比具有高硬度、高抗弯强度以及热膨胀系数低等优异的物理性能,但其加工过程困难。旨在揭示脉冲激光-超声复合辅助车削SiCp/Al复合材料的切屑形成机理。方法 建立理论模型来确定最小未变形切屑厚度,进而揭示脉冲激光-超声复合辅助车削SiCp/Al切屑形成的临界条件。并比较常规车削、脉冲激光辅助车削和脉冲激光-超声复合辅助车削的切屑形态,探究脉冲激光功率对切屑形成机理的影响。结果 研究表明,当脉冲激光作用于材料表面时,会产生热软化效应。这种效应使材料更易去除,并减少了切屑自由表面颗粒的破损程度。此外,在超声振动的辅助下,切屑连续性得到进一步改善。通过对加工后工件表面形貌测试发现,脉冲激光-超声复合辅助加工的表面粗糙度最小,为0.388μm,与常规加工相比降低了70.8%;脉冲激光-超声复合辅助加工的亚表面变形层厚度最小,为37.28μm。结论 通过深入分析复合车削切屑的形成及其对表面质量的影响,为优化SiCp/Al复合材料的表面质量提供了有力的理论支撑和实用的加工方法。SiCp/Al composites stand out from traditional metal materials due to their exceptional physical properties,including ultra-high hardness,high bending strength and a significantly low thermal expansion coefficient.These attributes render them suitable for a broad range of industrial applications that demand performance under extreme conditions.However,the integration of high-strength SiC particles into the SiCp/Al matrix poses significant challenges in processing.Investigating the chip formation during the machining process is instrumental in uncovering the deformation behavior of the material,which can,in turn,enhance tool life and surface quality through the development of effective processing technologies.To gain a deeper understanding of the chip formation mechanism,the cutting process of pulsed laser and ultrasonic composite machining on SiCp/Al composites was documented with high-speed photography(PCO.Dimax HS4).This advanced technology was used to precisely capture the dynamic deformation characteristics between the tool and the composite material.Subsequently,image processing software was employed to extract changes in the shear angle during the cutting process(Figure 3),which was pivotal for comprehending the deformation behavior of the material.The experimental setup included a RiKe P100M pulsed laser with power increment from 0 W to 50 W in 10 W steps,and a theoretical model was formulated based on the experimental outcomes.The primary objective of this study was to ascertain the minimum thickness of undeformed chips during pulsed laser and ultrasonic processing of SiCp/Al and to elucidate the critical conditions for chip formation.The theoretical model was subsequently validated with scanning electron microscopy(JSM-IT500)to observe chip morphology at various cutting depths(Figure 6).Furthermore,the chip morphology under conventional machining,laser-assisted machining,and pulsed laser-ultrasonic composite assisted machining was examined,and the impact of laser power on the chip formation mechanism was

关 键 词：脉冲激光-超声复合辅助车削 SICP/AL 切屑形成机理 表面质量 

分 类 号：TG50[金属学及工艺—金属切削加工及机床]