Understanding interfacial engineering of surface functionalized boron nitride nanosheets within thermal interface materials  

作　　者：Gaojie Han Yuezhan Fengg Changyu Shen 

机构地区：[1]State Key Laboratory of Structural Analysis,Optimization and CAE Software for Industrial Equipment,National Engineering Research Center for Advanced Polymer Processing Technology,Zhengzhou University,Zhengzhou 450002,China

出　　处：《Science China Materials》2025年第4期1300-1302,共3页中国科学(材料科学)(英文版)

摘　　要：The continuous miniaturization and high-power development of electronic devices have given rise to severe interface thermal issues,which urgently demand highly thermally conductive thermal interface materials(TIMs)to eliminate excessive heat accumulation and ensure the normal operation of devices[1].

关 键 词：interfacial engineering heat accumulation interface thermal issueswhich thermal interface materials surface functionalized boron nitride nanosheets electronic devices thermal conductivity 

分 类 号：TB3[一般工业技术—材料科学与工程]