激光层裂法检测粘接结构界面结合强度的研究  

Study on interface bonding strength of the bonded structures measured by laser spalling method

作　　者：吴合槟 朱帅光 廖永红 谭善源 柯金龙 林超辉 张永康 WU Hebin;ZHU Shuaiguang;LIAO Yonghong;TAN Shanyuan;KE Jinlong;LIN Chaohui;ZHANG Yongkang(School of Electromechanical Engineering,Guangdong University of Technology,Guangzhou 510006,China;Guangdong Provincial Key Laboratory of Advanced Manufacturing Technology of Marine Energy Equipment,Guangzhou 510006,China;Guangzhou Mechanical Science Research Institute Co.Ltd.,Guangzhou 510006,China)

机构地区：[1]广东工业大学机电工程学院,广州510006 [2]广东省海洋能源装备先进制造技术重点实验室,广州510006 [3]广州机械科学研究院有限公司,广州510006

出　　处：《激光技术》2025年第2期278-283,共6页Laser Technology

基　　金：国家重点研发计划资助项目(2018YFB1107700);广州市基础研究计划资助项目(2024A04J4135)。

摘　　要：为了解决常规无损检测技术无法检测出“吻接”和“弱粘接”问题,选取自主设计的可变脉宽Nd∶YAG激光器,采用3种方法处理表面,并使用两种粘接剂制备了粘接强度为4.68 MPa、17.69 MPa、21.35 MPa的不同粘接结构;采用固定的激光参数对粘接结构进行了激光冲击实验验证。结果表明,当激光脉宽为30 ns、光斑直径为4 mm、激光能量为8 J时,抗拉强度为37 MPa的3M DP460粘接件未发生层裂,抗拉强度为15 MPa的3M DP810粘接件发生层裂损伤;随着激光能量的增大,4.68 MPa粘接结构的界面脱粘面积由12.5 mm 2增大至50.0 mm^(2),而21.35 MPa的粘接结构没有发现明显损伤,说明在合适的激光参数下,激光层裂技术可作为一种无损检测手段,准确识别出粘接界面“弱粘接”和“吻接”。此研究可为激光层裂法在粘接结构界面结合强度检测领域的应用提供参考。To solve the problem of“kiss bonding”and“weak bonding”which cannot be detected by conventional nondestructive testing technology,a self-designed variable pulse width Nd∶YAG laser was selected.Three surface treatment methods and two kinds of adhesives were used to prepare the bonded structures of 4.68 MPa,17.69 MPa,21.35 MPa.The fixed laser parameters were used to verify the bonded structures by laser shock experiment.The results show that when the laser pulse width is 30 ns,spot diameter is 4 mm and laser energy is 8 J,the 3M DP460 adhesive with the tensile strength of 37 MPa does not have spalling damage,while the 3M DP810 adhesive with the tensile strength of 15 MPa has spalling damage.With the increase of laser energy,the interface debonding area of 4.68 MPa bonded structure increases from 12.5 mm 2 to 50.0 mm 2,while no obvious damage is found in 21.35 MPa bonded structure,indicating that under appropriate laser parameters,laser spalling technology can be used as a non-destructive testing method to effectively detect“weak bonding”and“kiss bonding”at the bonding interface.This study provides a reference for the application of laser spalling technology in the field of interface bonding strength detection of bonded structures.

关 键 词：激光技术 激光层裂 粘接结构 结合强度 无损检测 

分 类 号：TN247[电子电信—物理电子学] V261.8[航空宇航科学与技术—航空宇航制造工程] TB331[一般工业技术—材料科学与工程]