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作 者:白志宁 夏维娟[1] 胡媛 王平[1] BAI Zhining;XIA Weijuan;HU Yuan;WANG Ping(China Academy of Space Technology(Xi’an),Xi’an 710000,China)
机构地区:[1]中国空间技术研究院西安分院,西安710000
出 处:《空间电子技术》2025年第2期121-126,共6页Space Electronic Technology
基 金:国家自然科学联合基金项目(编号:U1537104)。
摘 要:航天科技不断发展,使得宇航微波模块产品不断向小型化、轻量化发展。硅铝结构管壳因结构复杂、质地硬脆等特点组装过程存在较大风险,组装或调测中器件修复极易造成管壳或周边器件的损伤。文章分析了星载微波模块产品的修复工况和修复难点,设计专用修复工装,改进修复工具的适用性以及修复垫片的应用,总结出一种兼顾修复成品率和效率的修复技术,在实际的修复过程中得以实施验证,从而降低修复风险,有效地提高了修复效率和质量。With the continuous development of aerospace technology,aerospace microwave module products are developing towards miniaturization,densification and lightweight.The shell of silicon aluminum structure has been widely used in microwave module products.However,due to its own structure and material characteristics,there are great risks in various links of assembly.When the components are repaired in the assembly or debugging process,it is easy to cause damage to the surrounding devices,especially the devices close to the shell wall,which is difficult to repair and has a high risk of shell damage,thus putting forward higher requirements for the repair process.This paper analyzes the repair conditions and repair difficulties of space-borne microwave module products,designs special repair tools,improves the applicability of repair tools and the application of repair gaskets.It summarizes a repair technology that takes into account the repair yield and efficiency.It has been verified in the actual repair process,thus reducing the repair risk and effectively improving the repair efficiency and quality.
分 类 号:V443[航空宇航科学与技术—飞行器设计] TN454[电子电信—微电子学与固体电子学]
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