退火温度和时间对铜铝复合材料组织与性能的影响  

Effects of annealing temperature and time on microstructure and properties of Cu-Al composites

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作  者:张丛睿 刘涛 赵帆 丁一 刘新华 Zhang Congrui;Liu Tao;Zhao Fan;Ding Yi;Liu Xinhua(China Electric Power Research Institute,Beijing 100192,China;Institute for Advanced Materials and Technology,University of Science and Technology Beijing,Beijing 100083,China)

机构地区:[1]中国电力科学研究院有限公司,北京100192 [2]北京科技大学新材料技术研究院,北京100083

出  处:《金属热处理》2025年第4期193-199,共7页Heat Treatment of Metals

基  金:国家电网公司总部科技项目(5108-202218280A-2-127-XG)。

摘  要:研究了退火温度和时间对连铸-轧制成形铜包铝复合扁排显微组织、硬度和界面结合强度的影响。结果表明:铜包覆层在150℃和200℃退火60 min时仅发生回复现象,硬度在120 HV0.025左右;在250℃退火时开始发生再结晶,在350℃退火时发生完全再结晶,硬度下降至61 HV0.025。铝芯在150~250℃退火60 min时仅发生回复现象,硬度在45 HV0.025左右;在300℃退火时开始发生再结晶,在350℃退火时发生完全再结晶,硬度下降至23 HV0.025。退火温度由150℃升高至300℃,铜铝复合界面层厚度由0增大至1.0μm,界面结合强度由75.0 MPa降低至66.0 MPa;退火温度升高至350℃后,界面层厚度增大速度变快,400℃退火时的界面层厚度为7.6μm,界面结合强度为45.7 MPa。在300℃退火时,退火时间由10 min延长至90 min时,铜包覆层再结晶程度逐渐提高,硬度由120.3 HV0.025下降至63.8 HV0.025;退火时间达到90 min后,为部分再结晶组织,进一步延长退火时间,显微组织和硬度变化不大。退火时间由10 min延长至120 min时,铝芯的再结晶程度略有增大,硬度由41.3 HV0.025降低至33.8 HV0.025;铜铝复合界面层厚度由0.2μm增大至1.3μm,界面结合强度由80.0 MPa降低至62.3 MPa。Effects of annealing temperature and time on the microstructure,hardness and interfacial bonding strength of copper-clad aluminum composite flat strips formed by continuous casting and rolling were studied.The results show that when annealed at 150℃and 200℃for 60 min,the copper cladding occurs only recovery,and the hardness is about 120 HV0.025.Recrystallization begins at 250℃,and complete recrystallization occurs at 350℃,and the hardness drops to 61 HV0.025.When annealed at 150-250℃for 60 min,the aluminum core only occurs recovery,and the hardness is about 45 HV0.025.Recrystallization begins at 300℃,complete recrystallization occurs at 350℃,and the hardness drops to 23 HV0.025.With the annealing temperature increases from 150℃to 300℃,the thickness of Cu-Al interfacial layers increases from 0 to 1.0μm,and the interfacial bonding strength decreases from 75.0 MPa to 66.0 MPa.When the annealing temperature rises to 350℃,the thickness of interface layers increases rapidly.The thickness of interface layers at 400℃is 7.6μm,and the interface bonding strength is 45.7 MPa.When annealing at 300℃,with the annealing time extends from 10 min to 90 min,the recrystallization degree of the copper cladding increases gradually,and the hardness decreases from 120.3 HV0.025 to 63.8 HV0.025.After the annealing time reaches 90 min,the microstructure is partially recrystallized.The microstructure and hardness have little change when annealing time is further extended.With the annealing time extends from 10 min to 120 min,the recrystallization degree of aluminum core is slightly increased,and the hardness is reduced from 41.3 HV0.025 to 33.8 HV0.025.The thickness of the Cu-Al interfacial layers increases from 0.2μm to 1.3μm,and the interfacial bond strength decreases from 80.0 MPa to 62.3 MPa.

关 键 词:铜铝复合材料 退火 界面 晶粒 硬度 

分 类 号:TG166[金属学及工艺—热处理]

 

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