Electronic thermal conductivity of tungsten-based systems during collision cascade processes  

作　　者：Jiong-Rong Wang Bi-Cai Pan 

机构地区：[1]Key Laboratory of Strongly-Coupled Quantum Matter Physics,Department of Physics,University of Science and Technology of China,Hefei 230026,China [2]Hefei National Laboratory for Physical Sciences at Microscale,University of Science and Technology of China,Hefei 230026,China

出　　处：《Nuclear Science and Techniques》2025年第5期167-176,共10页核技术(英文)

基　　金：supported by the Collaborative Innovation Program of Hefei Science Center of CAS(No.2022HSC-CIP007)。

摘　　要：The thermal conductivity of plasma-facing materials(PFM)exposed to intense radiation is a critical concern for the reliable usage of materials in fusion reactors.However,limited research has been performed regarding the thermal conductivity of structures that rapidly change in a short time during collision cascade processes under irradiation.In this study,we employed the tight-binding(TB)method to investigate the electronic thermal conductivity(κ_(e))of tungsten-based systems during various cascading processes.We found thatκ_(e) values sharply decrease within the initial 0.3 picoseconds and then partially recover at a slow pace;this is closely linked to the evolution of defects and microstructural distortions.The increase in the initial kinetic energy of the primary knock-on atom and the presence of a high concentration of hydrogen atoms further decrease theκ_(e) values.Conversely,higher temperatures have a significant positive effect onκ_(e).Furthermore,the presence of a grain boundary∑5[001](130)substantially reducesκ_(e),whereas the absorption effect of point defects by the grain boundary has little influence onκ_(e) during cascades.Our findings provide a theoretical basis for evaluating changes in the thermal conductivity performance of PFMs during their usage in nuclear fusion reactors.

关 键 词：Electronic thermal conductivity Collision cascade TUNGSTEN Plasma-facing materials Tight-binding calculations 

分 类 号：O469[理学—凝聚态物理]