基于高阶累积切片的圆阵一维测向算法研究  

Research on One-dimensional Direction Finding Algorithm for Circular Array Based on High-order Cumulative Slicing

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作  者:周烨 ZHOU Ye(Unit 32201 of PLA,Baicheng 137000,China)

机构地区:[1]中国人民解放军32201部队,吉林白城137000

出  处:《现代信息科技》2025年第8期6-9,15,共5页Modern Information Technology

摘  要:针对圆阵测向算法在环境噪声和多径干扰下测向虚警率高、精度低的问题,文章提出了一种基于高阶累积切片空间稀疏表示的一维测向算法。该算法首先利用最大期望的思想,构造出包含信号入射方向全部信息并去除冗余信息的高阶切片矩阵,实现高阶累积切片空间中等效信号强度的空域稀疏特征重构;然后通过线性插值及双边插值降低重构量化误差,获得备选角度集及对应的超完备阵列流形矩阵,并进行迭代优化,再进行二次重构;最后基于空域稀疏特征重构结果,将信号分量进行分离,实现各个分量的高精度测向,并对算法复杂度进行了分析。仿真试验结果表明,相比典型稀疏重构类算法,在信噪比为-10 dB时,所提算法的测向精度提高了约4倍,角度分辨概率提升约80%。Aiming at the problem of high false alarm rate and low accuracy of circular array directionfinding algorithm under ambient noise and multipath interference,this paper proposes a one-dimensional direction finding algorithm based on high-order cumulative slicing space sparse representation.Firstly,the algorithm uses the idea of Expectation Maximization to construct a high-order slice matrix containing all the information of the incident direction of the signal and removing the redundant information,so as to realize the spatial sparse feature reconstruction of the equivalent signal strength in the high-order cumulative slice space.Secondly,through linear interpolation and bilateral interpolation,the reconstruction quantization error is reduced,and the candidate angle set and the corresponding overcomplete array manifold matrix are obtained.The iterative optimization is carried out,and then the secondary reconstruction is carried out.Finally,based on the results of spatial sparse feature reconstruction,the signal components are separated to achieve high-precision directionfinding of each component,and the complexity of the algorithm is analyzed.The simulation results show that compared with the typical sparse reconstruction algorithms,when the Signal-to-Noise Ratio is-10 dB,the directionfinding accuracy of the proposed algorithm is increased by about 4 times,and the angle resolution probability is increased by about 80%.

关 键 词:阵列测向 空间重构 多径干扰 累积切片 

分 类 号:TN911.7[电子电信—通信与信息系统]

 

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